Printed circuit board integrated with ceramic film circuit, and manufacturing method thereof

Abstract

The invention discloses a printed circuit board integrated with a ceramic film circuit, and a manufacturing method thereof. The printed circuit board comprises a first dielectric layer and a second dielectric layer which are stacked up and down, a first metal layer is clamped between the first dielectric layer and the second dielectric layer, the first dielectric layer is provided with a blind groove, the blind groove exposes the first metal layer, bonding pads are formed on the first dielectric layer on the two sides of the blind groove, a conductor layer is formed on the first metal layer in the blind groove, a second metal layer is formed on the lower surface of the ceramic film circuit, a third metal layer is formed on the upper surface of the ceramic film circuit, the ceramic film circuit is located in the blind groove, the second metal layer is electrically connected with the conductor layer, and the third metal layer is welded with the bonding pads on two sides of the blind groove. According to the invention, the reliability and consistency of ceramic film circuit assembly can be improved.

Description

technical field [0001] The invention relates to the technical field of circuit board mounting, in particular to a printed circuit board integrating ceramic thin film circuits and a manufacturing method thereof. Background technique [0002] Ceramic thin film circuits have high dielectric constant, high processing precision, and small temperature drift. They have excellent performance and a wide range of application scenarios in the field of radio frequency and microwave. However, ceramic thin-film circuits are usually mounted directly to PCBs (printed circuit boards) using a micro-assembly process. Due to the limitations of the dielectric constant and processing accuracy of the board, the bonding and gold wire bonding of ceramic thin-film circuits require manual operations and mass production. At the same time, it relies heavily on manual control, the degree of automation is low, and the consistency of product performance is difficult to guarantee. It is easy to have inconsi...

AI Technical Summary

Problems solved by technology

However, ceramic thin-film circuits are usually mounted directly to PCBs (printed circuit boards) using a micro-assembly process. Due to the limitations of the dielectric constant and processing accuracy of the board, the bonding and gold wire bonding of ceramic thin-film circuits require manual operations and mass production. When it is used, it relies heavily on manual control, the degree of automation is low, and it is difficult to guarantee the consistency of product performance. It is easy to have inconsistent heights between the ceramic thin film circuit and the printed circuit board, and it is difficult to automatically align the solder when soldering, and it is easy to shift and fall off.

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