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Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus

A technology of charged particle beam and heat regulation, applied in the direction of circuits, discharge tubes, electrical components, etc., can solve troubles and other problems

Pending Publication Date: 2021-06-15
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, uninvited particles can be troublesome for patterns with small critical feature sizes, which have been adopted to meet the increasingly advanced performance requirements of IC chips

Method used

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  • Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus
  • Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus
  • Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus

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Embodiment Construction

[0022] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the drawings, where the same numerals in different drawings represent the same or similar elements unless otherwise indicated. The implementations set forth in the following description of the exemplary embodiments are not representative of all implementations consistent with the present invention. Rather, they are merely exemplary of apparatus and methods consistent with the aspects of the invention recited in the appended claims.

[0023] The enhanced computing power of electronic devices (while reducing the physical size of the device) can be achieved by significantly increasing the packing density of circuit components such as transistors, capacitors, diodes, etc. on an IC chip. For example, an IC chip for a smartphone (an IC chip the size of a thumb) can include over 2 billion transistors, each small...

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Abstract

An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims priority to US Application 62 / 756,483, filed November 6, 2018, the entire contents of which are incorporated herein by reference. technical field [0003] Embodiments provided herein disclose a charged particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning the temperature of a wafer. Background technique [0004] When manufacturing semiconductor integrated circuit (IC) chips, pattern defects or uninvited particles (residues) inevitably appear on the wafer or mask during the manufacturing process, thereby reducing yield. For example, unsolicited particles can be troublesome for patterns with smaller critical feature sizes that have been employed to meet the increasingly advanced performance requirements of IC chips. [0005] Pattern inspection tools with charged particle beams have been used to ...

Claims

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Application Information

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IPC IPC(8): H01J37/28H01J37/22
CPCH01J2237/24578H01J2237/24585H01J2237/24592H01J2237/2001H01J37/28H01J37/222H01L21/67288H01L21/67745H01J37/20H01J2237/2814
Inventor M·范赫门J·戈斯
Owner ASML NETHERLANDS BV