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A tooling fixture for cutting silver alloy bonding wire and its working method

A technology of silver alloy keys and tooling fixtures, which is applied in the field of electronic equipment assembly, can solve problems such as low work efficiency, and achieve the effects of convenient operation, improved cutting efficiency, and space saving

Active Publication Date: 2022-06-07
SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a tooling fixture for cutting silver alloy bonding wire and its working method, by setting the fixture tooling that can place multiple groups of bonding wire rolls, to solve the problems in the prior art proposed in the above-mentioned background technology The problem of low work efficiency

Method used

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  • A tooling fixture for cutting silver alloy bonding wire and its working method
  • A tooling fixture for cutting silver alloy bonding wire and its working method
  • A tooling fixture for cutting silver alloy bonding wire and its working method

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Embodiment Construction

[0027]The following will be combined with the accompanying drawings in the embodiments of the present invention, the technical solution in the embodiments of the present invention will be described clearly and completely, it is clear that the embodiments described are only a part of the embodiment of the present invention, not all embodiments. The specific embodiments described herein are merely intended to explain the present invention and are not intended to qualify the present invention. Based on embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work, are within the scope of protection of the present invention.

[0028] The present invention provides, for example Figure 1-4 One of the shown for silver alloy bonding wire cutting tooling fixture, mainly composed of base 1, lead pipe 3, partition 4, clamping assembly, cutting assembly, detachable release assembly and other components.

[0029] See Fig...

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PUM

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Abstract

The invention discloses a tooling fixture for cutting silver alloy bonding wire and its working method. The lead tube of the bonding wire, one end of the lead tube is provided with a clamping assembly for clamping the bonding wire, and a cutting assembly for cutting the bonding wire is arranged in the clamping assembly; the fixing plate One side of one side is fixedly connected with at least four sets of partitions, and a detachable pay-off assembly for placing bonding wire rolls is arranged between the partitions. In the present invention, at least four sets of baffles are fixedly connected on one side of the fixing plate, and a detachable pay-off assembly for placing bonding wire rolls is provided between the baffles, so that multiple sets of bonding wires of different types can be placed. The wire roll reduces the switching frequency of the bonding wire and improves the cutting efficiency of the bonding wire.

Description

Technical field [0001] The present invention belongs to the field of electronic equipment assembly technology, specifically relates to a kind of tooling fixture for cutting silver alloy bonding wire. It also involves a working method for cutting silver alloy bonding wires with work fixtures. Background [0002] Lead bonding dominates connection methods due to process simplicity, low cost, and a variety of package forms, with more than 90% of all package pins currently bonded. Bonding wire is a suitable for fine metal wire, the use of heat, pressure, ultrasonic energy to provide the ability of the electronic interconnection technology, lead bonding is a process that can be firmly welded, in this process, two metal materials (metal wire and substrate surface) tight bonding, once the surface is in close contact, there will be electron sharing or atomic mutual diffusion. [0003] In micro-assembly technology, there are often cases of coexistence of multiple wire diameter bonding wire...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21F11/00B21F23/00
CPCB21F11/00B21F23/002
Inventor 李盛伟邱敏雄王元钊王元锋李蓝屏
Owner SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD