Wire saw mechanism and wire saw cutting device based on small-load robot

A wire saw and tensioning device technology, which is applied to sawing equipment, band saws, wood processing appliances, etc., can solve problems such as small adjustment range, and achieve increased tension adjustment range, efficient cutting processing, and uniform force Effect

Pending Publication Date: 2021-06-18
HUAQIAO UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, in the pre-rough machining of small models of hard and brittle materials such as small plaster models, seal stones, or workpiece materials such as wood, manual removal of materials is usually used, or diamond wire saws are used for cutting. The existing diamond When adjusting the tension of the wire saw, it is usually adjusted by a separate tension wheel. In this adjustment method, the adjustment range is small and needs to be improved.

Method used

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  • Wire saw mechanism and wire saw cutting device based on small-load robot
  • Wire saw mechanism and wire saw cutting device based on small-load robot
  • Wire saw mechanism and wire saw cutting device based on small-load robot

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Embodiment Construction

[0031] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0032] Certain directional terms used hereinafter to describe the drawings, such as "inner," "outer," "above," "below" and other directional terms, are to be understood those directions involved in the drawing. Unless otherwise specified, the directional terms described in this specification basically follow the conventional directions understood by those skilled in the art.

[0033] The terms "first", "first", "second", "second" and similar terms used in the present invention do not indicate any order, quantity or importance in the present invention, but Used to distinguish one part from other parts.

[0034] refer to Figure 1-Figure 5 , a wire saw mechanism 100, the wire saw mechanism 100 includes a frame 1, the frame 1 is arcuate and has an arcuate opening 11, the frame 1 includes a connecting arm 12 and two cantilevers 13, the cantileve...

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Abstract

The invention provides a wire saw mechanism and a wire saw cutting device based on a small-load robot. The wire saw mechanism comprises a rack, a diamond string bead wire, a driving device, a driving wheel, two tensioning wheels, two guide wheels and two auxiliary wheels. The tensioning wheels are arranged on the two sides of the driving wheel and adjustably get away from or get close to the driving wheel so as to change the tensioning force of the diamond string bead wire; the auxiliary wheels are arranged between the driving wheel and the tensioning wheels and push the diamond string bead wire to abut against the driving wheel and the tensioning wheels; and the auxiliary wheels adjustably move so as to change the tensioning force of the diamond string bead wire. According to the technical scheme, the wire saw mechanism with a large tension adjusting range can be provided.

Description

technical field [0001] The invention relates to a wire saw mechanism and a wire saw cutting device based on a small load robot. Background technique [0002] At present, in the pre-rough machining of small models of hard and brittle materials such as small plaster models, seal stones, or workpiece materials such as wood, manual removal of materials is usually used, or diamond wire saws are used for cutting. The existing diamond When adjusting the tension of the wire saw, it is usually adjusted by a separate tension wheel. In this adjustment method, the adjustment range is small and needs to be improved. Contents of the invention [0003] The object of the present invention is to overcome the shortcomings in the above-mentioned prior art, and provide a wire saw mechanism and a wire saw cutting device based on a small-load robot. [0004] In order to solve the above technical problems, the present invention provides a wire saw mechanism, including a frame, a diamond beaded ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/08B28D7/00B27B13/00B27B13/08
CPCB28D1/08B28D7/00B27B13/00B27B13/08
Inventor 尹方辰崔长彩伊建黄辉黄国钦徐西鹏
Owner HUAQIAO UNIVERSITY
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