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Chip welding process

A chip welding and process technology, applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve problems such as welding problems that are difficult to meet the ultra-fine pitch of electronic chips, and achieve the effect of ensuring quality and consistent thickness

Pending Publication Date: 2021-06-18
HANA MICROELECTRONICS JIAXING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous development of science and technology, the assembly of electronic chips is becoming more and more dense and miniaturized, so the assembly of chips is facing various challenges. SMT printing technology is a traditional process of chip assembly, but now this technology is difficult to meet the electronic The soldering problem of the ultra-fine pitch of the chip cannot be overcome by the improvement of the printing scheme, so a new soldering method is needed

Method used

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings and examples.

[0021] Such as Figures 1 to 4 As shown, a chip welding process includes the following steps: the suction nozzle of the placement machine sucks the chip 1 and moves it down to the solder holding fixture 3, the solder ball of the chip 1 dips the solder 2; and then the chip 1 dipped with the solder 2 Move to the PCB board to complete mounting and soldering. The welding equipment is a welding furnace. The position of the chip 1 in the present invention does not need to be filled with solder, and there is no need to consider the problem of the ultra-fine spacing of the chip 1. Only by moving the chip 1 down and dipping the solder 2, it is transferred to the PCB board to complete the paste. Assembling and welding, the operation is simple and convenient.

[0022] The solder containing jig 3 of the present invention is provided with a groove, and the solder 2 i...

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Abstract

The invention discloses a chip welding process which comprises the following steps that a suction nozzle of a chip mounter sucks a chip and moves the chip downwards to a welding flux containing clamp, and a welding ball of the chip is dipped with welding flux; and then the chip dipped with the solder is moved to the PCB to complete surface mounting and welding.

Description

technical field [0001] The invention relates to the field of chip processing, in particular to a chip welding method. Background technique [0002] With the continuous development of science and technology, the assembly of electronic chips is becoming more and more dense and miniaturized, so the assembly of chips is facing various challenges. SMT printing technology is a traditional process of chip assembly, but now this technology is difficult to meet the electronic The soldering problem of the ultra-fine pitch of the chip cannot be overcome by the improvement of the printing scheme, so a new soldering method is needed. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a chip welding process that can be welded at ultra-fine pitches to solve the shortcomings of the prior art. [0004] The invention comprises the following steps: the suction nozzle of the placement machine sucks the chip and moves down to the solde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H05K3/34
CPCH01L24/81H05K3/34H01L2224/81801
Inventor 王松涛康亮
Owner HANA MICROELECTRONICS JIAXING