Cooling device, cooling method and method of manufacturing semiconductor package

Abstract

The invention provides a cooling technique capable of cooling a rectangular substrate which is subjected to heat treatment in a short time and uniformly, and a method of manufacturing a semiconductor package capable of manufacturing a high-quality semiconductor package. A cooling device comprises a cooling plate for cooling a substrate positioned at a cooling position from below; an elevating mechanism for raising and lowering a substrate between a cooling position and a standby position higher than a cooling position in a vertical direction with respect to the cooling plate; a correcting mechanism which has a correcting member which can be brought into contact with an upper surface of a peripheral part of the substrate, and corrects a peripheral part of the substrate to a cooling position by positioning a correcting member in a cooling position in the vicinity of four sides of the substrate positioned at a cooling position, thereby controlling the posture of the substrate.

Description

technical field [0001] The present invention relates to a cooling device for cooling a rectangular substrate, a cooling method, and a manufacturing method for manufacturing a semiconductor package using the substrate. Background technique [0002] In recent years, in the field of semiconductor devices, there has been a very high demand for reducing the size and thickness of devices. In order to meet such demands, panel-level fan-out packaging technology (FOPLP) that manufactures semiconductor packages using a rectangular-shaped substrate has attracted attention. In order to manufacture semiconductor packages using the FOPLP technique, it is proposed to use a substrate processing apparatus described in, for example, Japanese Patent Laid-Open No. 2019-36654. [0003] In the apparatus described in Japanese Patent Application Laid-Open No. 2019-36654, as part of semiconductor package manufacturing, the next pre-exposure process is performed before the exposure and development p...

AI Technical Summary

Problems solved by technology

As a result, it takes time to cool down the substrate on the delivery stage, so too much heat is applied to the cured film and so-called overbaking occurs

For these reasons, it is difficult to form a cured film with good film quality on the substrate, so it is difficult to form a good pattern shape and a uniform pattern size on a plane by exposing and developing the cured film.

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