A mass transfer device and transfer method thereof

Abstract

The present invention relates to the technical field of mass transfer, in particular to a mass transfer device and a transfer method thereof. The mass transfer device includes: a transfer container containing an insulating liquid; The electrode plates are set, and the polarity of the two electrode plates is opposite; a second substrate for accommodating the transferred LED chip is provided on the opposite surface of one electrode plate and the other electrode plate; a laser emitting diode is provided outside the transfer container. head, the laser emitting head is aligned with the LED chip on the first substrate, the first substrate is arranged between two electrode plates and installed on the first displacement device, and the first displacement device is used to control the vertical downward movement of the first substrate move. In the mass transfer method of the present invention, there is no need to use the transfer head to pick it up, so the transfer process will not be limited by the size of Micro LED chips, which greatly meets the transfer requirements of Micro LED chips of various sizes.

Description

technical field [0001] The invention relates to the technical field of mass transfer, in particular to a mass transfer device and a mass transfer method using the device. Background technique [0002] With the development of science and technology, light-emitting diodes (Light Emitting Diode, LED) due to its good stability, life, and low power consumption, color saturation, fast response, strong contrast, etc., so It has become an important display element in display screens. A large number of LED chips are installed on the existing LED display panel, and in the production process of the display screen, the LED chips need to be transferred from the growth substrate to the display backplane of the display screen. [0003] In the existing technology, when it is necessary to transfer the LED chip from its growth substrate to the display backplane, it needs to use the transfer head to pick up the LED chip on the first substrate and then place it on the second substrate. This m...

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Problems solved by technology

[0003] In the existing technology, when it is necessary to transfer the LED chip from its growth substrate to the display backplane, it needs to use the transfer head to pick up the LED chip on the first substrate and then place it on the second substrate. This method is often affected by the size of the transfer head; with the further development of LED display technology, the size of the LED chip is getting smaller and smaller, and the size of the existing Micro LED (micro light emitting diode) has reached the μm level; The size of the chip is too small, and it is difficult for the transfer head to pick it up, so the existing transfer method can no longer meet the transfer needs of Micro LED chips.

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