A semiconductor laser chip and its application method
An application method and laser technology, applied in semiconductor lasers, lasers, phonon exciters, etc., can solve the problems of high cost, low production capacity, and scratches and contamination of the strips to be coated, so as to increase production capacity, reduce production costs, and avoid problems. The effect of electrode scratching contamination
Active Publication Date: 2022-02-18
Shandong Huaguang Optoelectronics Co. Ltd.
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Problems solved by technology
[0006] The purpose of the present invention is to provide a semiconductor laser chip and its application method to solve the problems of scratch pollution, high cost and low production capacity in the prior art. , to avoid scratches and pollution quality problems caused by the contact of the P / N surface of the adjacent bar to be coated, and at the same time improve the uniformity of the coating, reduce the cost, and increase the production capacity
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[0042]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0043] Such as Figure 1-Figure 7 Shown, a kind of semiconductor laser chip, described chip P face is arranged with several P face recessed areas 2 sequentially, and described chip N face is arranged with several N face non-recessed areas 4 in sequence; Bar process, the adjacent coated bars 6 are fit and fitted through the recessed area 2 on the P face and the non-recessed area 4 on the N face.
[0044] The P surface of the chip is also provided with several P...
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The invention discloses a semiconductor laser chip and an application method thereof. The P surface of the chip is arranged with several P-surface recessed regions in sequence, and the N surface of the chip is arranged with several N-surface non-recessed regions in sequence; when the The chip is subjected to the pendulum process, and the adjacent coated bars are fit and fitted through the P-surface recessed area and the N-surface non-recessed area; the P-surface of the chip is also provided with several P-surface non-recessed areas, and the P-surface The non-recessed area and the P-surface recessed area are arranged at intervals; the N-surface of the chip is provided with several N-surface recessed areas, and the N-surface non-recessed area and the N-surface recessed area are arranged at intervals. The invention discloses a semiconductor laser chip and an application method thereof. The chip structure design is reasonable, which not only reduces the production cost, but also improves the coating efficiency, ensures the coating quality, and also solves electrode pollution and scratches during the coating process. Technical problems, improved product yield, has high practicability.
Description
technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a semiconductor laser chip and an application method thereof. Background technique [0002] The working principle of the semiconductor laser is the excitation method. The semiconductor material is used to transition between energy bands to emit light, and the cleavage surface of the semiconductor crystal is used to form two parallel mirrors as mirrors to form a resonant cavity, so that the light oscillates, feeds back, and amplifies the radiation of the generated light. , output laser light. In the manufacturing process, the chip is first cleaved into strips to form a resonant cavity, but its light extraction efficiency is low. It is necessary to evaporate a reflective film and an anti-reflection film on both sides of the cavity surface to improve its light extraction efficiency. [0003] In the conventional preparation process, in order to ensure the output rate of...
Claims
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IPC IPC(8): H01S5/32H01S5/30
CPCH01S5/1082H01S5/30
Inventor 刘青冯兴联苏建徐现刚
Owner Shandong Huaguang Optoelectronics Co. Ltd.