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Integrated radiator

A heat sink, integrated technology, applied in the direction of cooling/ventilation/heating transformation, modification with liquid cooling, electrical components, etc., can solve the problems of affecting heat dissipation effect and low heat flux density

Pending Publication Date: 2021-06-18
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned related technologies, the inventor believes that: the above-mentioned heat pipe radiator has a long cavity, resulting in a low heat flux density, which in turn affects the heat dissipation effect

Method used

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Examples

Experimental program
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Embodiment Construction

[0027] Contraction below Figure 1-3 Further detailed description of the present application.

[0028] This application example discloses a one-piece radiator.

[0029] Refer figure 1 , figure 2 The integrated heat sink includes an evaporation chamber 1, which is connected to the condenser 2 of the evaporation chamber 1, and the evaporation chamber 1 side is provided with a liquid inlet 11 in the evaporation chamber 1, and the working body is passed into the evaporation chamber 1. In the present embodiment, the condenser 2 includes a plurality of spaced heat sink 21, a plurality of connecting passages 22, a set channel 23, and two guards 24, two. One end of the guard plate 24 is welded to one end of the set channel 23 away from each other, and the other end is welded to one end of the evaporation chamber 1, and the two guard plates 24, the set passage 23, and the evaporation chamber 1 synthesize a receiving chamber 4, heat dissipating fins 21 and connectivity. The channel 22 is loc...

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Abstract

The invention relates to the technical field of radiators, and especially relates to an integrated radiator. The integrated radiator comprises an evaporation chamber and a condenser communicated with the evaporation chamber, and the evaporation chamber is provided with a liquid inlet. The condenser comprises a plurality of heat dissipation fins arranged at intervals, a plurality of connecting channels located between the adjacent heat dissipation fins and communicated with the evaporation chamber, and a collection channel fixedly connected to the ends, away from the evaporation chamber, of the heat dissipation fins, and the collection channel is communicated with the connecting channels. The condenser is directly communicated with the evaporation chamber, so that gasified steam can immediately enter the connecting channels, the heat dissipation fins can quickly cool the steam, the heat flux density is high, and the heat dissipation effect is improved.

Description

Technical field [0001] The present application relates to the field of heat sink, in particular, involving an integrated radiator. Background technique [0002] At present, the heat generated in the operation during operation is transferred to avoid the device or instrument that affects its normal operation, and the common heat sink can be divided into air cooling, heat tube heat sink, liquid cooling, semiconductor according to the heat dissipation mode. Refrigeration, compressor refrigeration and other types; with the improvement of the safety requirements of the whole machine, and the operating frequency of electronic components is getting higher and smaller, the volume is getting smaller, but the heat transfer density is getting bigger and bigger, and the existing aluminum Squeezing, the shovel teeth technology can not satisfy the heat dissipation requirements of high-heat flow density. With the development of technology, the emergence of heat pipe radiators solves the heat di...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20309H05K7/20318H05K7/20327
Inventor 贺西昌窦兰月
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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