Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip test equipment and test method applied to integrated circuit

A technology for integrated circuit and chip testing, applied in electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of occupying a large space, reducing the operating space of workers, unable to simulate the performance of integrated circuit chips, etc., and achieving a reduced operating space. Effect

Inactive Publication Date: 2021-06-22
深圳群芯微电子有限责任公司
View PDF2 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to make up for the shortcomings of the existing technology, it solves the problem that the equipment cannot simulate different environments to test the performance of integrated circuit chips, so that the test equipment needs to change the model of different equipment when testing chips of different sizes and models, and a variety of different testing machines Type will take up a lot of space, so that the operator's operating space is reduced, the present invention proposes a chip testing equipment and testing method applied to integrated circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip test equipment and test method applied to integrated circuit
  • Chip test equipment and test method applied to integrated circuit
  • Chip test equipment and test method applied to integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as Figure 1 to Figure 3 As shown, the present invention provides a technical solution: a chip testing device applied to integrated circuits, including a base 1, the top of the base 1 is fixedly connected with a power distribution cabinet 2, and the power distribution cabinet 2 is far away from the base 1 One side is fixedly connected with a fixed plate 3, and the side of the fixed plate 3 away from the power distribution cabinet 2 is fixedly connected with a central control mechanism 4, and the middle part of the side of the fixed plate 3 close to the central control mechanism 4 is fixedly connected with a chip simulation Drive mechanism 5, one end of the chip analog drive mechanism 5 is electrically connected to the operating device 7 through the transmission data line 6, the two ends of the operating device 7 are fixedly connected to the base 1 and the fixed plate 3 respectively, and the base 1 The four corners of the bottom are fixedly connected with supporting...

Embodiment 2

[0041] Such as Figure 3 to Figure 5 As shown, the present invention provides a technical solution on the basis of Embodiment 1: a chip testing device applied to integrated circuits, the fixing mechanism 553 includes a connecting shell b1, and one side of the connecting shell b1 slides A piston rod b2 is connected, and one end of the piston rod b2 inside the connection housing b1 is provided with a buffer device b3, and the end of the piston rod b2 away from the connection housing b1 is fixedly connected with a clamping device b4, and the connection housing The side of b1 close to the piston rod b2 is fixedly connected to the electromagnet b5, the side of the clamping device b4 close to the piston rod b2 is fixedly connected to the magnet block b6, and the side of the connection housing b1 away from the end of the piston rod b2 is connected. There is an air outlet b7, and the terminals of the electromagnet b5 are electrically connected to the central control mechanism 4 throug...

Embodiment 3

[0044] Such as Figure 4 to Figure 7 As shown, the present invention provides a technical solution on the basis of Embodiment 2: a chip testing device applied to integrated circuits, one end of the inner wall of the temperature detection device b44 is provided with a connecting rectangular groove c1, and the temperature detection device b44 The side of the inner wall of b44 is fixedly connected with an elastic sealing band c2, and the end of the elastic sealing band c2 away from the temperature detection device b44 is fixedly connected with a top plate c3, and one end of the inner wall connecting the rectangular groove c1 is fixedly connected with a spring c4, the spring The end of c4 away from the connecting rectangular slot c1 is fixedly connected with an arc-shaped limiting plate c5, and the side of the arc-shaped limiting plate c5 close to the spring c4 is fixedly connected with a temperature detector c6; The air makes the elastic sealing belt c2 deform and drives the top ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of integrated chip testing, and particularly relates to chip testing equipment applied to an integrated circuit, which comprises a fixed plate, a central control mechanism is fixedly connected to one side of one side, far away from a power distribution cabinet, of the fixed plate, and a chip simulation driving mechanism is fixedly connected to the middle of one side, close to the central control mechanism, of the fixed plate. One end of the chip simulation driving mechanism is electrically connected with an operation device through a transmission data line, and the mobile end of the mobile positioning mechanism is fixedly connected with a mobile pin clamping plate; the test chip can work at different temperatures to test the performance of the chip, so that the test equipment does not need to change the model of the equipment when testing chips with different sizes and models; a chip testing method applied to an integrated circuit comprises the following steps: respectively adjusting the temperatures to zero DEG C, 20-35 DEG C and 35-50 DEG C through a temperature adjusting device for testing, and respectively recording the running speeds of a tested chip at different temperatures and the time when the tested chip rises to the highest temperature.

Description

technical field [0001] The invention belongs to the technical field of testing integrated chips, in particular to a chip testing device and a testing method applied to integrated circuits. Background technique [0002] With the development of semiconductor manufacturing technology, the use cost of machinery is particularly important in the factors affecting the maximum profit. In the back-end test, because the low-end integrated circuit test equipment in the existing technology often only has one PMU (Precision Measurement Unit, precision measurement unit), PMU is used to accurately measure the relevant parameters of direct current. It can not only drive current into the device for measurement, but also provide voltage to the device to measure the current generated. Low-end integrated circuit test equipment It usually also includes a limited number of DPS (Device Power Supply, power device) power channels, usually 4 DPS power channels, but the limited number of DPS power cha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2868G01R31/2874
Inventor 陈益群季伟徐刚陈泓翰
Owner 深圳群芯微电子有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com