A precise cutting device for silicon wheat integrated circuit

Abstract

The invention discloses a precise cutting device for silicon-wheat integrated circuits, which includes a processing chamber, a rotating rod is arranged at the middle position of both ends of the processing chamber, and a rotating rod is arranged at the bottom end of the processing chamber to be connected with the rotating rod. In the second drive assembly, four sets of collars are evenly sleeved on the outer side of the rotating rod, and the first cutting disc is installed on the outer side of the collars, and a mounting ring is installed on one end of the collars. In the present invention, through the cooperative use of the adjustment assembly, the second drive assembly, the first cutting disk, the collar and the second cutting disk, the distance between the adjacent two groups of first cutting disks and the gap between the first cutting disk and the connecting bearing The distance between the first cutting disc and the second cutting disc can be manually and accurately adjusted, so that the device can cut silicon wheat integrated circuits of different widths, which improves the accuracy of cutting The degree of application can also improve the scope of application of the device, which is conducive to popularization and use.

Description

technical field [0001] The invention relates to the technical field of processing silicon wheat integrated circuits, in particular to a precise cutting device for silicon wheat integrated circuits. Background technique [0002] An integrated circuit is a microelectronic device or component that uses a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit, and interconnects them together to form a small or several small semiconductor chips or chips. Dielectric substrate, and then packaged in a package, to become a microstructure with the required circuit functions; all the components have been integrated in the structure, making electronic components towards miniaturization, low power consumption, intelligence and high reliability. A big step forward in terms of sex. [0003] At present, after the processing of silicon wheat integrated circuits, operators need to manually cooperate with the cutting device t...

AI Technical Summary

Problems solved by technology

[0003] At present, after the processing of silicon wheat integrated circuits, operators need to manually cooperate with the cutting device to cut multiple groups of circuit boards connected together. However, the distance between multiple groups of cutting discs in the current precision cutting device is often fixed, and it cannot The distance between the circuit boards adjusts the distance between the cutting discs, thereby reducing the scope of application of the device; and the current silicon wheat integrated circuit board often requires the operator to hold the silicon wheat integrated circuit board in order to carry out the cutting process. Accurate cutting cannot automatically send the silicon wheat integrated circuit board into the cutting device for cutting and processing, which is very inconvenient and increases the labor intensity of the operator; however, when the current cutting device cuts the silicon wheat integrated circuit, a large amount of debris will be generated due to cutting. If these debris cannot be removed in time, it may affect the cutting effect of the device, and also affect the air environment around the device; at the same time, the current cutting device needs to be manually assisted by the operator when cutting the silicon wheat integrated circuit The silicon wheat integrated circuit cannot further improve the stability of the silicon wheat integrated circuit in the cutting process, nor can it automatically push the cut silicon wheat integrated circuit out of the device, which is very inconvenient

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