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High-end device for polishing two surfaces of PCB

A PCB board, two-sided technology, applied in the field of high-end devices, can solve the problem of resin not being polished cleanly, and achieve the effect of reducing labor intensity

Active Publication Date: 2021-06-29
广东恒兆丰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the current commonly used grinding method, the PCB board will pass between the opposite grinding wheels, but this grinding method cannot take into account the uneven surface of the PCB board, and it is easy to expose the base material at the protrusion or the depression The resin is not polished clean, causing more serious quality control problems. The technical problem to be solved: provide a high-end method that can quickly polish both sides of the PCB board, and at the same time can feed and clamp the PCB board. A high-end device for grinding both sides of PCB boards by rotating to remove powder, which can reduce the labor intensity of workers

Method used

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  • High-end device for polishing two surfaces of PCB
  • High-end device for polishing two surfaces of PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] A high-end device for polishing both sides of the PCB board, such as figure 1 As shown, it includes a base plate 1, a fixed frame 2, a first slide rail 3, a clamping mechanism 4, and a grinding mechanism 5. The upper and front sides of the base plate 1 are symmetrically provided with a fixed frame 2, and the base plate 1 is provided with a first slide rail 3. A clamping mechanism 4 is slidably connected between the two first slide rails 3 , a grinding mechanism 5 is connected between the two fixed frames 2 , and the clamping mechanism 4 cooperates with the grinding mechanism 5 .

[0069] When it is necessary to polish both sides of the PCB board, the worker will clamp the PCB board through the clamping mechanism 4, and the worker pushes the clamping mechanism 4 to move in the first slide rail 3, thereby driving the PCB board to move to contact with the grinding mechanism 5, and to grind Mechanism 5 will polish the two sides of the PCB board, and the worker repeats the a...

Embodiment 2

[0071] In a preferred embodiment of the present invention, as Figure 1-Figure 8 As shown, the clamping mechanism 4 includes a first slider 41, a first support frame 42, a clamp 43 and a first spring 44, and the first slider 41 is slidably provided on the two first slide rails 3, and the two pieces The first slide block 41 is equipped with a first support frame 42 in a rotating manner, and the two first support frames 42 are slidably provided with a clamp 43, and the two clamps 43 are equipped with a first spring 44. Both ends of the spring 44 are respectively connected to the first supporting frame 42 and the clamp 43 .

[0072] When the PCB board needs to be clamped, the worker holds the clamp 43, pulls the two clamps 43 to move outward, the first spring 44 is compressed, and when the gap between the two clamps 43 is large, the worker puts the PCB board. When entering between the two clamps 43, the worker loosens the clamps 43 to reset the first spring 44, thereby driving t...

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Abstract

The invention relates to a polishing device, in particular to a high-end device for polishing the two surfaces of a PCB. According to the high-end device for polishing the two surfaces of the PCB, the two surfaces of the PCB can be subjected to high-end polishing rapidly; and meanwhile, the PCB can be fed and clamped, the PCB can be rotated to remove powder, and therefore the labor intensity of workers can be relieved. The high-end device for polishing the two surfaces of the PCB comprises bottom plates and fixing frames, and the fixing frames are symmetrically arranged on the bottom plates. First sliding rails are included and are arranged on the bottom plates. A clamping mechanism is included and is connected between the two first sliding rails in a sliding manner. And a polishing mechanism is included and is connected between the two fixing frames, and the clamping mechanism is matched with the polishing mechanism. According to the high-end device, the clamping mechanism is arranged, the clamping mechanism is matched with the polishing mechanism so that the PCB can be clamped, and meanwhile the two surfaces of the PCB can be polished. And through cooperation of the clamping mechanism and a rotating mechanism, powder and other impurities on the PCB can fall off.

Description

technical field [0001] The invention relates to a grinding device, in particular to a high-end device for grinding both sides of a PCB board. Background technique [0002] PCB boards are also called printed circuit boards. PCB boards are the provider of electrical connections for electronic components. PCB boards can be divided into single-panel, double-panel and other multi-layer circuit boards according to the number of circuit board layers. With the vigorous development of the electronics industry, The demand for PCB boards is also increasing, and at the same time, the difficulty of manufacturing high-end PCB boards is also increasing. At present, the commonly used grinding method will make the PCB board pass between the opposite grinding wheels, but this grinding method is not very good. Taking into account the uneven surface of the PCB board, it is easy to expose the substrate in the protrusions or the resin in the depressions is not polished, causing serious quality co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/10B24B41/00B24B41/06B24B41/02B24B27/00B24B47/12H05K3/00
CPCB24B7/10B24B41/005B24B41/06B24B41/02B24B27/0076B24B47/12H05K3/00
Inventor 钟衍滔
Owner 广东恒兆丰科技有限公司
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