A kind of low-frequency acoustic wave sensor and fabrication method of silicon micro-cantilever beam
A technology of low-frequency sound waves and cantilever beams, which is applied in the direction of measuring ultrasonic/sonic/infrasonic waves, instruments, and utilizing wave/particle radiation. It can solve the problems of complex structure and low sensitivity of FP-type low-frequency sound wave sensors, and achieve good flatness and consistency. performance, high sound pressure response sensitivity, and size-consistent effect
Active Publication Date: 2022-07-19
HUAZHONG UNIV OF SCI & TECH
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[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a low-frequency acoustic wave sensor and a method for manufacturing a silicon micro-cantilever beam, the purpose of which is to solve the complex structure and low sensitivity of the FP-type low-frequency acoustic wave sensor in the prior art question
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[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0030] In order to illustrate the effect of the present invention, the method of the present invention will be described in detail below by taking the water turbine regulating system as the implementation object of the present invention. Among them, the principle diagram of the turbine regulating system is as follows figure 1 shown. The flow of the method provided in this application is described ...
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The invention discloses a low-frequency acoustic wave sensor and a manufacturing method of a silicon micro-cantilever beam, belonging to the technical field of silicon micro-machining and optical sensing measurement. The low-frequency acoustic wave sensor comprises: a silicon micro-cantilever beam, which is prepared by using SOI wafers The geometric structure with high aspect ratio is used to receive acoustic wave signals; the input optical fiber forms an FP cavity with the silicon micro-cantilever beam, and the distance from the silicon micro-cantilever beam to the upper end face of the input optical fiber is the length of the FP cavity; the package structure, It is connected with the silicon micro-cantilever beam and the input optical fiber for fixing the silicon micro-cantilever beam and the input optical fiber. The preparation method of the silicon micro-cantilever beam provided by the present invention is simple in process, low in cost and high in yield; the low-frequency acoustic wave sensor provided by the present invention is compact in structure, simple in preparation, good in consistency, high in sensitivity, and has a response characteristic in a low-frequency test frequency band below 250 Hz It is highly consistent with the theory.
Description
technical field [0001] The invention belongs to the technical field of silicon micromachining and optical sensing measurement, and more particularly relates to a low-frequency acoustic wave sensor and a manufacturing method of a silicon microcantilever beam. Background technique [0002] Low-frequency sound waves have the characteristics of low attenuation, strong diffraction ability, and long propagation distance. Compared with traditional piezoelectric-based acoustic wave sensors, optical fiber-based sensors have the advantages of volume efficiency, light weight, corrosion resistance, and resistance to electromagnetic interference. [0003] The acousto-optic transducer is the most important working unit of the fiber optic acoustic wave sensor. Common acousto-optic transducers include thin films and cantilevers. However, since the thin film structure undergoes tensile deformation when subjected to pressure, its deformation is affected by the film tension, so the sound pres...
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IPC IPC(8): G01H9/00
CPCG01H9/004
Inventor 鲁平唐艳秋付陆君朱旭司马朝坦刘德明
Owner HUAZHONG UNIV OF SCI & TECH