Semiconductor packaging structure and preparation method thereof

Abstract

The invention discloses a semiconductor packaging structure and a preparation method thereof. The semiconductor packaging structure comprises a plastic packaging body, at least one chip module, at least one receiving antenna module and at least one transmitting antenna module, wherein the chip module, the receiving antenna module and the transmitting antenna module are located in the plastic packaging body, and projections of the chip module, the receiving antenna module and the transmitting antenna module in the plastic packaging body are not overlapped and are spaced by a preset distance; the first surface of the receiving antenna module is provided with a receiving antenna, and the first surface of the transmitting antenna module is provided with a transmitting antenna; the second surface of the receiving antenna module is provided with a first connection bonding pad, the second surface of the transmitting antenna module is provided with a second connection bonding pad, and the surface of the chip module is provided with a third connection bonding pad. According to the technical scheme provided by the embodiment of the invention, the size and the thickness of the semiconductor packaging structure are reduced.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductors, and in particular to a semiconductor packaging structure and a manufacturing method. Background technique [0002] In communication devices, chip modules and antennas need to be packaged together to form a semiconductor package structure, wherein the antenna is a device for receiving and transmitting electromagnetic wave signals, and serves as a carrier for signal transmission between different chip modules. [0003] The current conventional semiconductor package structure includes a package body provided with a chip module and an antenna module vertically stacked on the surface of the package body. Wherein, the package body includes a substrate, a chip module located on the surface of the substrate, metal pillars and plastic packaging materials. The antenna module is mounted on the surface of the package and welded on the metal post. [0004] The defect of the ...

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Problems solved by technology

[0004] The defect of the traditional semiconductor package structure with antenna module is that it is necessary to form a high metal pillar in the package, and the thickness of the entire semiconductor package structure is equal to the thickness of the substrate, the height of the metal pillar and the thickness of the antenna module. resulting in larger volume and thickness of the entire semiconductor package structure

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