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A thermoelectric device with a low-stress installation structure and its installation and fixing method

A technology of thermoelectric devices and installation structures, which is applied in the direction of electrical components, generators/motors, casings/cabinets/drawer components, etc., can solve the problems of brittle failure, poor mechanical properties of semiconductor thermoelectric materials, and inability to resist shearing. Cutting force and other issues, to reduce the impact of stress, good operability and expandability, to ensure the release of thermal expansion stress

Active Publication Date: 2022-06-28
SHANGHAI INST OF SPACE POWER SOURCES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a thermoelectric device with a low-stress mounting structure, which solves the problem that semiconductor thermoelectric materials have poor mechanical properties and cannot resist the influence of shear force and are prone to brittle failure.

Method used

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  • A thermoelectric device with a low-stress installation structure and its installation and fixing method
  • A thermoelectric device with a low-stress installation structure and its installation and fixing method
  • A thermoelectric device with a low-stress installation structure and its installation and fixing method

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Experimental program
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Embodiment

[0048] First, tighten the heat soaking block 12 to the high temperature contract sleeve 11 by screws, and design a conical surface tight fit between the two to ensure the high efficiency of heat transfer, and then install the elastic element 13 to the heat soaking block 12, and the three form heat The end fixing structure; the hot end fixing structure is fixed on the base through the heat insulating material, so that the thermoelectric device can be installed.

[0049] At this time, the fixed substrate on the cold end face of the thermoelectric device body 20 is fastened on the cooling block 31 by screws to form a cooling assembly. During installation, use tooling to press the cooling block 31, and at the same time, the guide grooves at the bottom of the cooling block 31 are precisely matched with the guide bars 33 of the structural base to move forward slowly, pressing the hot end elastic element 13 to a predetermined position. Then, from the inside of the high temperature al...

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PUM

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Abstract

The invention discloses a thermoelectric device with a low-stress installation structure and an installation and fixing method thereof. The thermoelectric device includes: a hot end fixing structure, a cold end fixing structure, and a thermoelectric device arranged between the hot end fixing structure and the cold end fixing structure The main body and several fixing parts; the hot end fixing structure includes: a superalloy sleeve, a soaking block for heat transfer from the superalloy sleeve, and an elastic element; the soaking block is arranged on the outside of the superalloy sleeve; the elastic element Clamped between the hot end surface of the thermoelectric device body and the soaking block; the fixed structure of the cold end includes: a cooling block, a structural shell, and a structural base fixedly connected to the structural shell; Pre-locking screw; the cooling block is provided with a pre-locking threaded hole adapted to the pre-locking screw; the pre-locking screw is screwed into the pre-locking threaded hole to achieve pre-locking. The invention has high mechanical stability and can release thermal expansion stress.

Description

technical field [0001] The invention relates to the technical field of semiconductor thermoelectric power generation, in particular to a thermoelectric device with a low-stress mounting structure and a mounting and fixing method thereof. Background technique [0002] Thermoelectric power generation refers to a technology that uses the Seebeck effect to convert thermal energy into electrical energy. According to different heat sources, thermoelectric power generation technology has important applications in many fields such as deep space exploration, deep sea power generation, and industrial waste heat utilization. The core device of thermoelectric power generation is the semiconductor thermoelectric material, which has the advantages of no noise, no pollution, simple structure, long service life and high reliability. Under some special conditions, such as long-duration space exploration missions, traditional solar power generation and battery energy storage and other energy...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02N11/00H05K5/02
CPCH02N11/002H05K5/0217
Inventor 吴春瑜刘洋马东李阳杨帅飞靳洋赵嘉伟刘世超
Owner SHANGHAI INST OF SPACE POWER SOURCES