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IGBT power module packaging equipment

A technology for power modules and packaging equipment, used in transportation and packaging, conveyor objects, electrical components, etc., can solve problems such as rework, chip displacement, collision with chips, etc., to reduce labor intensity and improve assembly efficiency.

Inactive Publication Date: 2021-07-13
HANGZHOU WOLEI INTELLIGENT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method that can not only realize the automatic installation of the clip of the IGBT power module, thereby improving the assembly efficiency and reducing the labor intensity; but also can avoid the chip that is easily pasted on the cooling plate during the clip installation process. , IGBT power module packaging equipment that causes the chip to shift, resulting in the problem that the IGBT power module needs to be reworked

Method used

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  • IGBT power module packaging equipment
  • IGBT power module packaging equipment
  • IGBT power module packaging equipment

Examples

Experimental program
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specific Embodiment 1

[0040] Specific embodiment one: as figure 1 , figure 2 , image 3 , Figure 4 As shown, an IGBT power module packaging equipment includes a frame, a module positioning tool 1 , a clip pre-supporting tool 2 , a clip installation mechanism 3 and a clip manipulator 4 .

[0041] The module positioning tool is used for positioning the IGBT power module 10, and the module positioning tool includes a support platform and positioning pins arranged on the support platform; in this embodiment, the positioning pins are vertically distributed. The IGBT module has a process hole, and the process hole cooperates with the positioning pin. The IGBT power module is supported on the support platform, and the process hole cooperates with the positioning pin to realize the positioning of the IGBT power module on the module positioning tool. The IGBT power module is manually positioned on the module positioning tool, or the IGBT module is automatically grabbed by the module grabbing manipula...

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Abstract

The invention discloses IGBT power module packaging equipment, and aims to provide the IGBT power module packaging equipment which can realize automatic installation of clamping pieces of an IGBT power module so as to improve the assembly efficiency and reduce the labor intensity, and can solve the problem that an IGBT power module needs to be reworked due to the fact that chips pre-pasted on a cooling plate are easily collided by clamping pieces in the installation process to cause displacement of the chips. The IGBT power module packaging equipment comprises: a rack; a module positioning tool for positioning an IGBT power module; a clamping piece pre-supporting tool, wherein the clamping piece pre-supporting tool comprises a clamping piece pre-supporting piece, and the clamping piece pre-supporting piece is used for supporting the clamping piece; a clamping piece manipulator for sucking the clamping piece; and a clamping piece installation mechanism, wherein the clamping piece installation mechanism comprises a transverse guide rail, a transverse sliding seat moving along the transverse guide rail, a transverse execution device used for pushing the transverse sliding seat, an electric clamping jaw or a starting clamping jaw arranged on the transverse sliding seat, a jacking air cylinder arranged on the transverse sliding seat and a pressing block arranged at the end of a piston rod of the jacking air cylinder.

Description

technical field [0001] The invention relates to a packaging device, in particular to a packaging device for an IGBT power module. Background technique [0002] A current IGBT power module includes a cooling plate, a plurality of chips distributed side by side are pre-attached on one surface of the cooling plate, and the chips and the cooling plate are clamped by clips. In this application, the packaging equipment of the IGBT power module refers to the packaging of the clip. Specifically, the clip has an elastic upper clip and an elastic lower clip. After the chip and the cooling plate are clamped by the clip, the cooling plate of the IGBT power module and the chip are clamped and fixed as a whole. At present, in the clip packaging process of this kind of IGBT power module, the operator generally uses manual packaging. Specifically, the clip is manually opened, and then the chip and the cooling plate are put into the clip, and then the clip is released. The cooling plate an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/68
CPCH01L21/67121H01L21/677H01L21/68
Inventor 郭斌马欣欣李静伟田建威王龙蒋诚杰何伟顺
Owner HANGZHOU WOLEI INTELLIGENT TECH