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Automatic surface mounting gluing device

An automatic patch and wafer technology, which is applied to the device for coating liquid on the surface, transportation and packaging, conveyor objects, etc., can solve the problems of low efficiency and high labor intensity, and achieve accurate assembly position, high efficiency and precision The effect of controlling the amount of glue

Pending Publication Date: 2021-07-16
SHANGHAI BRANCH FUZHOU GAOYI COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing crystal rings and wafers are assembled manually, which is labor-intensive and inefficient

Method used

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  • Automatic surface mounting gluing device
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  • Automatic surface mounting gluing device

Examples

Experimental program
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Effect test

Embodiment Construction

[0033] Such as Figure 1-8 Shown, a kind of automatic patch gluing device of the present invention, it comprises:

[0034] Frame 1, the frame 1 is divided into upper and lower layers, the lower layer of the frame 1 places electrical control components, etc., and the middle part of the frame 1 is fixed with an organic platform;

[0035] The crystal ring feeding mechanism 2 is arranged on one side of the machine table, and is used for the transfer and feeding of the crystal ring;

[0036] Wafer feeding mechanism 3 is arranged on one side of the machine table and is used for transferring and feeding wafers;

[0037] Wafer turning mechanism 4 is arranged on one side of the machine table, used for turning over the wafer and adjusting the angle of the wafer;

[0038] The main worktable 5 is arranged in the middle of the machine table, and the main workbench 5 is provided with an assembly table 6, a manipulator 7 and a dispensing mechanism 8;

[0039] The end of the manipulator 7 ...

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PUM

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Abstract

The invention discloses an automatic surface mounting gluing device. The automatic surface mounting gluing device comprises a rack, a wafer ring feeding mechanism, a wafer feeding mechanism, a wafer overturning mechanism, a main worktable and a finished product placement mechanism, wherein the main worktable is arranged in the middle of a machine table, an assembling table, a manipulator and a dispensing mechanism are arranged on the main worktable, and the finished product placement mechanism is arranged on the other side of the machine table and used for placing assembled finished products. Wafer and wafer ring assembling is more efficient, and working hours are saved. Besides, the glue output amount can be precisely controlled, the assembling position is precise, the reliability and the consistency are high, and the assembling cost is low.

Description

technical field [0001] The invention relates to the field of assembly machinery, in particular to an automatic patch gluing device. Background technique [0002] The existing crystal rings and wafers are manually assembled, and the manual assembly is labor-intensive and low in efficiency. Contents of the invention [0003] The purpose of the present invention is to provide a high-efficiency automatic pasting and gluing device. [0004] To achieve the above object, the present invention adopts the following technical solutions: [0005] An automatic patch gluing device, comprising: [0006] rack, the middle part of the rack is fixed with a platform; [0007] The crystal ring feeding mechanism is set on one side of the machine for the transfer and feeding of the crystal ring; [0008] Wafer feeding mechanism, set on one side of the machine table, used for transferring and feeding wafers; [0009] Wafer flipping mechanism, set on one side of the machine, used for flippin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10B05C5/02B65G47/90B65G47/248
CPCB05C5/0208B05C11/1002B65G47/248B65G47/90
Inventor 谢永红刘浩王晓斌
Owner SHANGHAI BRANCH FUZHOU GAOYI COMM CO LTD
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