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Heat dissipation structure of electronic water pump

A technology of electronic water pump and heat dissipation structure, which is applied to pumps, parts of pumping devices for elastic fluids, pump devices, etc., can solve the problems of vehicle safety, hidden dangers, and inability to do so, so as to improve heat dissipation efficiency and solve The effect of large security risks

Pending Publication Date: 2021-07-20
JIANGSU LANGXIN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At this stage, the heat dissipation of the electronic water pump casing and the circuit board on it is: through the cooling fins installed on the casing and the flow of gas to achieve cooling, because the electronic water pump is installed in the engine compartment and the engine compartment The ambient temperature is high, which leads to low heat dissipation efficiency of the water pump during work. At the same time, because the circuit board itself has a temperature protection function, when the temperature exceeds a certain temperature, the water pump will stop working, and there is a great safety hazard in the driving of the vehicle. In addition, Due to the above problems, it is not possible to make high-power (100W and above) water pumps

Method used

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  • Heat dissipation structure of electronic water pump
  • Heat dissipation structure of electronic water pump
  • Heat dissipation structure of electronic water pump

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] like Figure 1 to Figure 3 As shown together, a heat dissipation structure of an electronic water pump includes a case 1 with one end open and a bottom plate 101 provided at one end (the circuit board 5 is mounted on the bottom plate 1 ), and an upper cover 2 is installed on the open end of the case 1 (both are equipped with flange plate structure), and also include a spacer seal assembly for installing the impeller of the electronic water pump. One end of the spacer seal assembly is clamped by the upper cover 2 and the casing 1, and the spacer seal is The other end of the assembly extends toward the bottom plate 1; the bottom plate 101 located in the casing 1 is provided with a spacer supporting and positioning structure, and the spacer supporting and positioning structure communicates with the interior of the spacer sealing assembly.

[0034] The supporting positioning structure of the spacer includes a positioning protrusion 3 arranged on the bottom plate 101, a flui...

Embodiment 2

[0040] The structure of this embodiment is basically the same as that of Embodiment 1, the difference is that:

[0041] like Figure 4 As shown, the bottom plate 101 and the casing 1 are of a split-molded structure, the bottom plate 101 and the casing 1 fit together, and are fixedly connected together by bolts and other connecting pieces (see figure 2 ); the bottom plate 101 and the casing 1 are made of metal; or, the bottom plate 101 and the casing 1 are made of plastic; or, one of the bottom plate 101 and the casing 1 is made of plastic Manufactured, the other one is made of metal material.

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Abstract

The invention discloses a heat dissipation structure of an electronic water pump. The heat dissipation structure comprises a machine shell with one end open and the other end provided with a bottom plate, an upper cover is installed at the open end of the machine shell, the heat dissipation structure of the electronic water pump further comprises a spacer bush sealing assembly, one end of the spacer bush sealing assembly is clamped by the upper cover and the machine shell, the other end of the spacer bush sealing assembly extends in the direction of the bottom plate, a spacer bush supporting and positioning structure is arranged on the bottom plate located in the machine shell and communicates with the interior of the spacer bush sealing assembly, a rotor assembly drives an impeller to rotate, the impeller drives cooling fluid such as cooling liquid to circularly flow, meanwhile, the cooling liquid enters the spacer bush sealing assembly and the spacer bush supporting and positioning structure communicating with the spacer bush sealing assembly to flow, heat on the bottom plate can be taken away, therefore cooling of the machine shell and a circuit board is achieved through the heat exchange principle, the heat dissipation efficiency is greatly improved, good conditions are provided for manufacturing a high-power water pump, and meanwhile the problems that the water pump stops working due to the fact that the temperature is too high, and potential safety hazards are large in the vehicle running process are solved.

Description

technical field [0001] The invention belongs to the technical field of electronic water pumps, in particular to a heat dissipation structure of electronic water pumps. Background technique [0002] At this stage, the heat dissipation of the electronic water pump casing and the circuit board on it is: through the cooling fins installed on the casing and the flow of gas to achieve cooling, because the electronic water pump is installed in the engine compartment and the engine compartment The ambient temperature is high, which leads to low heat dissipation efficiency of the water pump during work. At the same time, because the circuit board itself has a temperature protection function, when the temperature exceeds a certain temperature, the water pump will stop working, and there is a great safety hazard in the driving of the vehicle. In addition, Limited by the above problems, it is impossible to make high-power (100W and above) water pumps. Contents of the invention [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F04D13/06F04D29/58F04D29/02F04D29/40
CPCF04D13/0606F04D13/0626F04D29/026F04D29/406F04D29/5813F04D29/588
Inventor 丁言闯戚纯波赵行行
Owner JIANGSU LANGXIN ELECTRIC