High-voltage silicon stack alloy processing device and alloying method

Abstract

The invention discloses a high-voltage silicon stack alloy processing device and an alloying method. The invention relates to the technical field of semiconductor processing, in particular to the high-voltage silicon stack alloy processing device and the alloying method. The high-voltage silicon stack alloy processing device comprises a workpiece, an annular electromagnetic heating device, a workpiece thickness monitoring unit, a pressure unit, a temperature sensor and a controller; the workpiece is formed by alternatively stacking a plurality of wafers and a plurality of soldering lugs; the workpiece is placed in the annular electromagnetic heating device; the pressure unit comprises an air source and an air cylinder, the air source is communicated with the air cylinder through an air supply pipeline, and an electromagnetic valve is further arranged on the air supply pipeline; and the annular electromagnetic heating device, the workpiece thickness monitoring unit, the temperature sensor, the air cylinder and the electromagnetic valve are all in communication connection with the controller. By means of the high-voltage silicon stack alloy processing device, the strength of the soldering lugs is improved, the downward pressing process is delayed, and it is ensured that the soldering lugs in an alloy have the uniform thickness and the regular form.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a high-voltage silicon stack alloy processing device and alloy method. Background technique [0002] The processing of high-voltage silicon stack diodes is made by cross-stacking several layers of wafers and several layers of solder (solder sheets), heating and pressing to form an integrated alloy block, and then cutting the alloy block into several unit silicon columns. . [0003] In alloy production, the high-frequency alloy machine commonly used at present uses compressed air as the power cylinder to provide pressure for the workpiece. During the pressurization process, it is heated to the solder liquidus temperature, so that several wafers are connected by solder bonding to achieve the purpose of alloy operation. However, in this alloy method, the compressed air connected to the cylinder is continuously opened, and the pressure output from the air supply pi...

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Problems solved by technology

However, in this alloy method, the compressed air connected to the cylinder is continuously opened, and the pressure output from the air supply pipeline connected to the cylinder to the cylinder of the alloy machine is not stable, and may fluctuate due to interference from other connected equipment

This kind of gas supply fluctuation will cause the pressure of the cylinder, piston and cylinder to fluctuate. Before the solder is heated to the liquidus temperature, the impact of the pressure change is not obvious; but after the solder is heated to the liquidus temperature, the sudden increase of the air pressure The increase will make the workpiece overpressure, the solder overflows, and the bonding area is too thin, resulting in the overall scrap of the alloy workpiece and a huge loss of raw materials

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