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Transfer printing method and device of flexible semiconductor film and liquid drop seal

A technology for semiconductors and stamps, applied in the fields of transfer printing methods, devices and droplet stamps of flexible semiconductor films, which can solve problems such as semiconductor film damage, achieve high-efficiency preparation, and avoid damage

Active Publication Date: 2021-07-23
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, this disclosure proposes a transfer printing method, device and droplet stamp of a flexible semiconductor film, which can solve the problem of using rubber stamps in the prior art. The problem of damage to the semiconductor film caused by this disclosure, and the transfer printing method provided by the present disclosure can prepare hybrid integrated flexible devices with high efficiency

Method used

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  • Transfer printing method and device of flexible semiconductor film and liquid drop seal
  • Transfer printing method and device of flexible semiconductor film and liquid drop seal
  • Transfer printing method and device of flexible semiconductor film and liquid drop seal

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Embodiment Construction

[0046] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

[0047] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

[0048] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific implementation manners. It will be understood by those skilled in the art that the present disclosure may be practiced without some of the specific details. In some instances, methods, means, componen...

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Abstract

The invention relates to a transfer printing method and device of a flexible semiconductor film and a liquid drop seal. The method comprises the steps of forming a first liquid drop on a seal bearing body, and obtaining the liquid drop seal; controlling the liquid drop seal to be close to the flexible semiconductor film so as to form a first liquid bridge between the flexible semiconductor film and the seal bearing body by using the first liquid drop; moving the liquid drop seal, and adsorbing the flexible semiconductor film to the liquid drop seal through the first liquid bridge; forming a second liquid drop on a flexible substrate; controlling the liquid drop seal to be close to the second liquid drop so as to form a second liquid bridge between the flexible substrate and the flexible semiconductor film by using the second liquid drop; and moving the liquid drop seal, adsorbing the flexible semiconductor thin film to the flexible substrate through the second liquid bridge, and separating the flexible semiconductor thin film from the liquid drop seal to complete transfer printing of the flexible semiconductor thin film. According to the method, the semiconductor thin film can be prevented from being damaged in the transfer printing process, and a hybrid integrated flexible device can be efficiently prepared.

Description

technical field [0001] The present disclosure relates to the field of flexible electronics, in particular to a transfer printing method and device for a flexible semiconductor film, and a droplet stamp. Background technique [0002] As a new type of semiconductor device, flexible electronic devices have made great breakthroughs in clinical monitoring and other applications. Flexible electronic devices can be made using different functional materials. For example, gallium nitride GaN or gallium arsenide GaAs are usually used to manufacture light-emitting elements. In order to integrate light-emitting elements on soft substrates to prepare flexible photodetectors, the light-emitting elements are It is an effective technical solution to form a flexible semiconductor film with light-emitting function, and then transfer the flexible semiconductor film to a silicon wafer. [0003] However, in the related art, in the process of transferring the flexible semiconductor film to the s...

Claims

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Application Information

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IPC IPC(8): B41K1/38
CPCB41K1/38
Inventor 冯雪李海成陈颖
Owner TSINGHUA UNIV
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