Photoelectric package and manufacturing method thereof
A production method and photoelectric technology, applied in the manufacture of circuits, electrical components, final products, etc., can solve the problems of limited packaging structure and process of photoelectric sensors, and meet the requirements of product power saving, light and small size, and improve brightness Effect
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no. 1 example
[0028] First, see figure 1 and figure 2 As shown, the first embodiment of the present application provides an optoelectronic package M1 , which includes a substrate 1 , an optoelectronic component 2 , a first encapsulant 3 and a second encapsulant 4 . The optoelectronic component 2 is arranged on the substrate 1 . Specifically, the substrate 1 can be, for example, but not limited to, a ceramic substrate, which includes a plurality of metal pads 12 and the optoelectronic component 2 is disposed on the metal pads 12, the metal pads are located on the side of the substrate 1, and through the conductive column and the The external electrode X on the other side of the metal pad 12 is electrically connected. The first encapsulant 3 covers the substrate 1 and is disposed around the optoelectronic component 2 . The second encapsulant 4 covers the first encapsulant 3 and the photoelectric component 2 . The first encapsulant 3 has a highest point T1 and a lowest point T2 , and the ...
no. 2 example
[0031] refer to Figure 3 to Figure 6 as shown, image 3 and Figure 4It is a side sectional view of the photoelectric package M2 of the second embodiment of the present application, Figure 5 and Image 6 It is an exploded perspective view of the photoelectric package M2 of the second embodiment of the present application. The second embodiment of the present application provides an optoelectronic package M2 , which includes a substrate 1 , a plurality of optoelectronic components 2 , a first encapsulant 3 , a second encapsulant 4 , a plurality of wires 5 and a wall 6 . The substrate 1 has an upper surface 101 and a lower surface 102. The substrate 1 includes a first metal pad 121 and a plurality of second metal pads 122. The first metal pad 121 and the plurality of second metal pads 122 are arranged on the upper surface 101 of the substrate 1. . A plurality of optoelectronic components 2 are disposed on the first metal pad 121 . One end of each wire 5 is welded to each...
no. 3 example
[0051] refer to Figure 17 to Figure 20 The third embodiment of the present application provides an optoelectronic package M3, which includes a substrate 1, a plurality of optoelectronic components 2, a first encapsulant 3', a second encapsulant 4', a wall 6 and a fourth encapsulant 7. The substrate 1 includes a plurality of metal pads 12 . A plurality of optoelectronic components 2 are respectively disposed on a plurality of metal pads 12 . The wall body 6 is arranged on the substrate and surrounds the plurality of optoelectronic components 2 . The first encapsulant 3' covers the surface 20 (including the upper surface and the side surface) of each optoelectronic component 2, and covers between the first encapsulant 3' and any two optoelectronic components 2 and between the wall body 6 and the adjacent In the space between the optoelectronic components 2 , the first encapsulant 3 ′ forms a cavity 30 between any two optoelectronic components 2 and between the wall 6 and the ...
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Abstract
Description
Claims
Application Information
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