Substrate for image sensor
An image sensor and substrate technology, applied in the field of image sensor substrates and camera modules, can solve the problems of increasing the number of assembly steps of multiple elastic components and complicating the module structure, so as to improve operational reliability, simplify the structure, and stabilize the structure Effect
Pending Publication Date: 2021-07-23
LG INNOTEK CO LTD
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- Description
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- Application Information
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Problems solved by technology
Therefore, the module structure of the camera device according to the prior art has a problem of complication
[0007] In addition, the camera device according to the related art requires a plurality of elastic members for moving the lens barrel, and there is a problem that the number of assembly steps of the plurality of elastic members increases
Method used
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[0084] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0085] However, the spirit and scope of the present invention are not limited to some of the embodiments described, but may be implemented in various other forms, and within the spirit and scope of the present invention, one or more elements of the embodiments may be selectively Combine and replace.
[0086] In addition, unless otherwise clearly defined and described, the terms (including technical terms and scientific terms) used in the embodiments of the present invention may be interpreted as having the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs, and Terms such as those defined in commonly used dictionaries may be interpreted to have meanings consistent with their meanings in the context of the prior art. In addition, the terms used in the embodiments of the present inventio...
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Abstract
A substrate for an image sensor according to an embodiment comprises: an insulating layer; and a conductive pattern portion arranged on the insulating layer, wherein the insulating layer comprises: a first insulating portion; and a second insulating portion surrounding the first insulating portion and spaced apart from the first insulating portion with an open area therebetween, and the conductive pattern portion comprises: a first lead pattern portion arranged on the first insulating portion; a second lead pattern portion arranged on the second insulating portion; and an extension pattern portion arranged on the open area of the insulating layer to connect the first lead pattern portion with the second lead pattern portion and including a bent portion.
Description
technical field [0001] Embodiments relate to a substrate for an image sensor. In particular, embodiments relate to a substrate for an image sensor capable of moving relative to a lens barrel and a camera module including the same. Background technique [0002] Generally, camera devices are installed in mobile communication terminals and portable devices such as MP3 players, and electronic devices such as automobiles, endoscopes, and CCTVs. Such camera devices are gradually being developed centering on high pixels, and are being miniaturized and thinned. In addition, current camera devices are changing so that various additional functions can be realized at low manufacturing costs. [0003] The camera device as described above includes a lens barrel accommodating a lens, a lens holder coupled to the lens barrel, an image sensor disposed in the lens holder, and a driving substrate on which the image sensor is mounted. At this time, the lens provides the image signal of the ...
Claims
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IPC IPC(8): H01L27/146H04N5/232H04N5/225H05K1/18
CPCH01L27/14636H04N23/54H04N23/687H04N23/55H01L27/14618H05K1/189H05K2201/10151H05K2201/10121G02B27/646H04N23/57H04N23/67G02B7/021H02K41/031H02K2201/18
Inventor 朴德勋白智钦孙荣晙
Owner LG INNOTEK CO LTD