Round plane magnetron sputtering target with rotary magnetic poles

Abstract

The invention provides a round plane magnetron sputtering target with rotary magnetic poles. The round plane magnetron sputtering target comprises a target base of a hollow cylindrical structure, a magnetic pole rotation system and the magnetic poles. The magnetic pole rotation system is arranged on the target base and movably connected with the target base; the magnetic pole rotation system is of a rotatable structure; and the magnetic poles are arranged on the magnetic pole rotation system and are driven by the magnetic pole rotation system to rotate. The multiple magnetic poles are evenly distributed in the radial direction of the magnetic pole rotation system, so that magnetic induction lines are distributed in the circumferential direction of a target material, the magnetic poles can rotate, obvious etching grooves are prevented from being formed in the surface of the target material, the utilization rate and the sputtering rate of the target material are improved, and therefore the defects in the prior art are overcome.

Description

technical field [0001] The invention specifically relates to a circular planar magnetron sputtering target with rotating magnetic poles. Background technique [0002] Reference document: Chinese Invention Patent Publication CN102719799A, publication date 20121010, discloses a rotating magnetron sputtering target and a corresponding magnetron sputtering device, the rotating magnetron sputtering target includes a cylindrical target, a pole piece and a magnetic The magnetron includes a first magnetic pole arranged in the middle of the magnetron and second magnetic poles arranged on both sides of the magnetron, and the polarities of the first magnetic pole and the second magnetic pole are opposite. [0003] In the rotating magnetron sputtering target in the reference file, the magnetic field is distributed along the cylindrical surface in the circumferential direction of the rotating cylinder, which belongs to the rotating cylindrical target. However, in practical applications,...

AI Technical Summary

Problems solved by technology

Under this magnetic field layout, etching grooves are formed on the surface of the target during the sputtering process, resulting in only the target in the etching groove being sputtered on the entire circular planar target, so the traditional circular planar magnetron sputtering The target utilization rate of the target is low

[0005] Therefore, there is a need for a circular planar magnetron sputtering target with rotating magnetic poles, which can solve the problem in the prior art that only the target in the etching groove is sputtered and the target utilization rate is low

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