Conductive multi-layer panel intended for the cockpit of a vehicle, in particular a motor vehicle
A technology for motor vehicles and cockpits, applied to vehicle parts, vehicle connectors, instrument panels, etc., can solve the problems of increased copper wire weight, cost, and complexity of intervention, improving process quality and reducing manufacturing time , the effect of reducing human error
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[0074] In the ensuing description of preferred embodiments of the invention, particular reference will be made to the application of the invention in the manufacture of conductive instrument panels for motor vehicle cockpits.
[0075] However, this application should not be construed as limiting, and the invention may also be applied to other cover panels for vehicles, in particular cockpits of motor vehicles, such as cover panels for doors of motor vehicles.
[0076] More specifically, the invention can also be applied to other panels in the cockpit of a vehicle, in particular a motor vehicle, for mounting electrical and electronic devices to which control signals and power supply signals have to be sent.
[0077] A cockpit instrument panel made in accordance with the teachings of the present invention includes a multi-layer structure, wherein one of the layers includes a flexible printed circuit board.
[0078] The flexible printed circuit board 10 is Figure 1a and Figure...
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