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Debonding system and debonding method

An inspection system, distance technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as low efficiency, defects, wafer cracks, etc.

Pending Publication Date: 2021-08-03
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, current wafer debonding systems and methods are inefficient and often result in wafer breakage and a large edge defect rate at the opposite side of the flat blade insertion point
On the other hand, double-sided lift-off systems and methods have a lower risk of defects near the edge of the wafer, but may require higher pulling forces, which may cause the wafer to crack
Accordingly, current wafer lift-off systems and methods are not entirely satisfactory

Method used

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  • Debonding system and debonding method
  • Debonding system and debonding method
  • Debonding system and debonding method

Examples

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Embodiment Construction

[0017] Various exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, so that those of ordinary skill in the art can make and use the present disclosure. After reading the present disclosure, it will be apparent to those of ordinary skill in the art that various changes or modifications may be made to the examples set forth herein without departing from the scope of the disclosure. Accordingly, the present disclosure is not limited to the exemplary embodiments and applications described and illustrated herein. In addition, the specific order and / or hierarchy of steps in the methods disclosed herein are exemplary approaches only. Based upon design preferences, the specific order or hierarchy of steps in the disclosed methods or processes may be rearranged while remaining within the scope of the present disclosure. Accordingly, those of ordinary skill in the art will understand that the methods and techniques disclosed h...

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PUM

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Abstract

A system and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding system comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

Description

technical field [0001] Embodiments of the present invention relate to a peeling system and a peeling method. Background technique [0002] To manufacture integrated circuits, semiconductor wafers are used to form integrated circuits. During the manufacturing process, integrated circuits are fabricated by performing a number of processing steps (e.g., etching steps, photolithography steps, deposition steps, etc.) on a semiconductor wafer (e.g., a silicon wafer); and subsequently dicing the semiconductor wafer into individual integrated circuit. In some applications, wafers are bonded together to form a wafer stack. In other applications, two or more wafers can be bonded together prior to the dicing step in order to achieve higher levels of integration, simplify the packaging process, or couple circuits or other components, which allows for thinning down) to fabricate integrated circuits on both sides of the wafer. Furthermore, as wafer level bonding shows promise for "Mor...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/77
CPCH01L21/67011H01L21/77H01L21/67092H01L21/6838H01L22/12H01L24/98B32B43/006B32B2457/14H01L21/02032H01L21/02079H01L24/799
Inventor 余承霏曹昌宸许庭耀胡政纲刘旭水白峻荣
Owner TAIWAN SEMICON MFG CO LTD