Diamond wire cutting material receiving device

Abstract

The invention discloses a diamond wire cutting material receiving device, and relates to the technical field of diamond wire cutting. The diamond wire cutting material receiving device comprises a cutting mechanism, a cutting table assembly and a material receiving table assembly, wherein the material receiving table assembly is arranged at one end of the cutting table assembly, a gap is formed between the cutting table assembly and the material receiving table assembly, and a cutting part of the cutting mechanism is arranged in the gap. The degree of mechanization is extremely high, materials can be cut only by manually placing the materials on the cutting table assembly, meanwhile, the cut materials enter the material receiving table assembly, so that the situation that the materials collide with the previous materials when falling due to downward inertia can be avoided, and the materials are prevented from being abraded; and the cutting table assembly is in butt joint with the material receiving table assembly through the cooperation of a positioning protrusion and a receding groove, the positioning protrusion is arranged in the middle of the side end of the material receiving table assembly, so that a cutting line of the cutting mechanism can penetrate through the gap between the upper end and the lower end of the positioning protrusion, the cutting mechanism does not need to move and does not need to stop working in the whole process, and the overall cutting efficiency can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of diamond wire cutting, in particular to a material receiving device for diamond wire cutting. Background technique [0002] Diamond wire cutting adopts the unidirectional or reciprocating circular motion of the diamond wire to form a relative grinding motion between the diamond wire and the object to be cut, so as to achieve the purpose of cutting. As a new cutting method, diamond wire cutting is widely used in the field of crystalline silicon wafers. By uniformly fixing diamond particles on high-strength steel wires with a certain distribution density, by repeatedly winding diamond wires on several On the wire device, the diamond wire is pulled back and forth at high speed to complete the cutting of the object. CN209303823U discloses a wire cutting device for bars, including a wire cutting machine, a positioning fixture and a receiving trough, when in use, the bars are inserted between the V-shaped posit...

AI Technical Summary

Problems solved by technology

[0003] The problem to be solved by the present invention is to place the material on the cutting table assembly, and then drive the cutting table assembly and the material to move back and forth in the X direction through the X-direction sliding mechanism, and drive the material receiving table assembly in the Y direction on the Y-direction sliding mechanism. Move left and right to dock with the cutting table assembly. The pushing mechanism on the upper end of the cutting table assembly pushes the object to move left and right in the Y direction to push the material to the cutting line of the cutting mechanism for cutting. The structure is simple and reasonable, and the degree of mechanization is extremely high. The material can be cut by placing the material on the cutting table assembly. At the same time, the cut material enters the receiving table assembly, which can effectively avoid the downward inertia that causes the material to collide with the previous material when it falls, and avoid the problem of material wear; Through the cooperation of the positioning protrusion and the relief groove, the cutting table assembly is docked with the material receiving table assembly. The positioning protrusion is arranged in the middle part of the side end of the material receiving table assembly, so that the cutting line of the cutting mechanism can be positioned at the upper and lower ends of the protrusion. The gap passes through, so that the cutting mechanism does not need to move and does not need to stop working during the whole process, which can effectively improve the overall cutting efficiency of the diamond wire cutting material receiving device

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