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Raw material screening equipment for preparing new semiconductor material

A screening equipment and new material technology, applied in solid separation, sieve, grid, etc., can solve problems such as waste, germanium powder is difficult to fall off, etc.

Inactive Publication Date: 2021-08-10
陈丽娜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the raw materials for the preparation of new semiconductor materials contain light germanium powder, if the raw material sieving machine for the preparation of new semiconductor materials sieves the germanium powder, it is easy to cause the germanium powder under the sieving plate to splash when the germanium powder falls. So that the floating germanium powder adheres to the bottom of the sieving plate, if the sieving machine stops running and the germanium powder adheres to the bottom of the sieving plate, it will cause the germanium powder to be difficult to fall off, resulting in unnecessary waste

Method used

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  • Raw material screening equipment for preparing new semiconductor material
  • Raw material screening equipment for preparing new semiconductor material
  • Raw material screening equipment for preparing new semiconductor material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] For example figure 1 -example Figure 5 Shown:

[0029] The invention provides a kind of raw material screening equipment for the preparation of new semiconductor materials. Its structure includes a top cover 1, a screening mechanism 2, and a base 3. The top cover 1 is installed at the top position of the screening mechanism 2. The screening mechanism 2 is installed at the upper end of the base 3; the screening mechanism 2 includes a screening plate 21, a casing 22, a bottoming block 23, and a booster bar 24, and the sides of the screening plate 21 are connected to the inner wall of the casing 22 , the side of the bottoming block 23 is movably engaged with the lower end of the casing 22 , and the booster bar 24 is installed between the top of the bottoming block 23 and the bottom of the casing 22 .

[0030] Wherein, the screening plate 21 includes an elastic strip a1, a telescopic block a2, a powder penetration hole a3, and a plate body a4, and the elastic strip a1 is...

Embodiment 2

[0036] For example Image 6 -example Figure 9 Shown:

[0037] Wherein, the air-permeable cavity b2 includes an outer tube c1, a reset piece c2, and a force plate c3, and the reset plate c2 is installed between the inner side of the force plate c3 and the inner wall of the outer tube c1, and the force plate c3 and The inner part of the outer tube c1 is movable, and there are two stress plates c3, which are evenly distributed symmetrically on the inside of the outer tube c1. The airflow extruded downward by the mechanism can make the force plate c3 move The tube c1 slides and expands to both sides, so that the airflow can be discharged downward through the gap between the two force plates c3.

[0038] Wherein, the force receiving plate c3 includes a positioning block c31, a blocking brush c32, a rear plate c33, and a connecting block c34, the left side of the positioning block c31 is attached to the right side of the rear plate c33, and the The blocking brush c32 is embedded i...

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Abstract

The invention discloses raw material screening equipment for preparing a new semiconductor material. The raw material screening equipment for preparing the new semiconductor material structurally comprises a top cover, a screening mechanism and a base; the top cover is installed at the top position of the screening mechanism; the screening mechanism is installed at the upper end position of the base; after a shell stops running, a telescopic block can continue to stretch out and draw back up and down along a plate body through cooperation of an elastic strip; after the telescopic block extends downwards, a lower swing plate can swing downwards, so that the lower swing plate can bounce off germanium powder at the bottom of the telescopic block, and the situation that the light germanium powder is easily splashed up, floats, is attached to the bottom of the screening plate and is difficult to clean is effectively avoided; and the rising germanium powder can be blocked by a blocking brush on a stress plate, and then the stress plate is pushed by a reset piece to reset to generate inertia force, so that a contact block can generate impact vibration on a combination plate under the cooperation of an elastic piece, and the blocked germanium powder can be vibrated off and removed.

Description

technical field [0001] The invention relates to the field of preparation of new semiconductor materials, in particular to raw material screening equipment for the preparation of new semiconductor materials. Background technique [0002] The raw material screening machine for the preparation of new semiconductor materials is mainly used to screen the particle size of the raw materials for the preparation of new semiconductor materials. The up and down shaking of the raw material sieving machine for the preparation of new materials can make the raw materials for the preparation of new semiconductor materials with small particles on the sieving plate fall downwards, thereby completing the screening of the raw materials for the preparation of new semiconductor materials. Based on the above description The inventors found that the existing raw material screening equipment for the preparation of new semiconductor materials mainly has the following deficiencies, for example: [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07B1/34B07B1/46B07B1/54B07B1/55
CPCB07B1/343B07B1/46B07B1/54B07B1/55
Inventor 陈丽娜
Owner 陈丽娜
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