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Integrated circuit thermal vacuum test system

A thermal vacuum test and integrated circuit technology, which is applied in CAD circuit design, electrical digital data processing, instruments, etc., can solve problems such as the inability to analyze and classify integrated circuits, and affect the accuracy of integrated circuit test results, so as to eliminate the impact and improve Efficiency and accuracy, and the effect of improving the degree of relevance

Inactive Publication Date: 2021-08-13
安徽芯鑫半导体有限公司
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Problems solved by technology

[0004] The purpose of the present invention is to provide a thermal vacuum test system for integrated circuits, the main purpose of which is to solve the problem that the integrated circuits in the entire temperature cycle process cannot be analyzed and classified as a whole in the existing solutions, thereby affecting the accuracy of the integrated circuit test results technical problem

Method used

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  • Integrated circuit thermal vacuum test system

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Embodiment Construction

[0036] The technical methods in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0037] see figure 1 As shown, the present invention is an integrated circuit thermal vacuum test system, including an operation acquisition module, a data transmission module, a data processing module, a data analysis module and a classification prompt module;

[0038] The operation acquisition module is used to collect the data information of the integrated circuit and the operation information of the vacuum test. The data information includes the type data, model dat...

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Abstract

The invention discloses an integrated circuit thermal vacuum test system, which is characterized in that an operation acquisition module is used for acquiring data information of an integrated circuit and operation information of a vacuum test, and a data processing module is used for receiving the data information and the operation information and processing the data information and the operation information to obtain data processing information and operation processing information; a data analysis module receives the data processing information and the operation processing information and performs calculation to obtain a number base value, an operation base value and a test coefficient, and the test coefficient is analyzed to obtain a test result. the classification prompting module classifies and prompts the tested integrated circuit according to the test result; and according to all aspects disclosed by the invention, the problem that the accuracy of the test result of the integrated circuit is influenced because the integrated circuit in the whole temperature cycle process cannot be integrally analyzed and classified in the existing scheme is solved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an integrated circuit thermal vacuum test system. Background technique [0002] Thermal vacuum test refers to the test to verify various performances and functions of the spacecraft and its components under vacuum and certain temperature conditions. It consists of cold soaking, hot soaking and variable temperature processes; Measure its working parameters and environmental parameters; cold soak is to keep the spacecraft and its components at the specified minimum temperature for the test, and stay for the specified time; hot soak is to make it at the specified maximum temperature for the test, and stay for the specified time. From room temperature to the specified minimum test temperature, first perform cold soaking, then rise to the specified test maximum temperature and perform hot soaking, and finally return to room temperature, forming a temperature cycle. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/32G06K9/62G06F115/12G06F119/08
CPCG06F30/32G06F2119/08G06F2115/12G06F18/241
Inventor 周蔚
Owner 安徽芯鑫半导体有限公司
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