Selective resin hole plugging method and circuit board

Abstract

The invention is suitable for the technical field of circuit board manufacturing processes, and provides a selective resin hole plugging method and a circuit board. The selective resin hole plugging method comprises the steps that a circuit board is provided, a first hole which does not need resin hole plugging and a second hole which needs resin hole plugging are formed in the circuit board, and hole copper is plated in the first hole and the second hole; pattern transfer is carried out on the circuit board, so that the board surface of the circuit board is covered by a dry film, only a first area is exposed, and the first hole is located in the first area; pattern electroplating is conducted on the first hole, so that a protruding part is formed on the board face of the circuit board, and the protruding part is located in the first area and surrounds an opening of the first hole; film stripping is conducted on the circuit board; and resin hole plugging is conducted on the second hole. The invention also provides a circuit board. The resin ink can be prevented from permeating into the through hole which does not need resin plugging, and the quality abnormity is avoided.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing technology, in particular to a method for selectively plugging holes with resin and a circuit board. Background technique [0002] The resin plugging process can solve a series of problems that cannot be solved by using green oil plugging or press-fit resin. Therefore, in recent years, the resin plugging process has been more and more widely used in the circuit board industry, especially in some layers. Products with high height and thicker boards are more popular. In production practice, some customers require to select some through-holes to be plugged holes and some through-holes not to be plugged holes in the same unit of the circuit board, which requires the use of selective resin plugging methods. [0003] The traditional process of selective resin plugging can be roughly divided into two types. The first process is: first drilling → sinking copper plate electric → drawin...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for selectively plugging holes with resin and a circuit board to solve the problem of uneven copper thickness on the surface of the circuit board in the traditional process, unclean etching of the outer layer circuit, poor consistency of line width and line spacing, and problems when When the distance between the via holes that require resin plug holes and the via holes that do not require resin plug holes is small, the resin ink will easily penetrate into the via holes that do not require resin plug holes during the resin plugging process, resulting in abnormal quality problems

Images