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Universal flip chip LED dispensing machine and dispensing method

An LED glue dispenser, a general-purpose technology, is used in devices and coatings that apply liquid to the surface. The effect of reducing labor intensity

Inactive Publication Date: 2021-08-17
JIANGXI LIANCHUANG NANFEN TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a universal flip-chip LED dispensing machine, which solves the problems of low dispensing efficiency and uneven dispensing in the prior art

Method used

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  • Universal flip chip LED dispensing machine and dispensing method
  • Universal flip chip LED dispensing machine and dispensing method
  • Universal flip chip LED dispensing machine and dispensing method

Examples

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Embodiment Construction

[0025] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0026] Such as Figure 1-8 A general-purpose flip-chip LED dispenser is shown, which is characterized in that it includes a body 1, a flip-chip LED placement mechanism 2 is movably installed on the body 1, and one side of the flip-chip LED placement mechanism 2 is provided with Glue solution providing device 3, on described glue solution providing device 3, be connected with dispensing mechanism 4, be provided with dispensing device 5 on described glue dispensing mechanism 4, also be equipped with angle sensor on described glue dispensing mechanism 4, described The body 1 is provided with a controller 6 , and the flip-chip LED placement mechanism 2 , glue supply device 3 and glue dispensing mechanism 4 are respectively electrically connected to the controller 6 .

[0027] Preferably, the flip-chip LED placement mechanism 2 includes a placement table 21, the ...

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PUM

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Abstract

The invention discloses a universal flip chip LED dispensing machine. The universal flip chip LED dispensing machine is characterized by comprising a machine body, a flip chip LED placing mechanism is movably mounted on the machine body, a glue solution supply device is arranged on one side of the flip chip LED placing mechanism, a dispensing mechanism is connected to the glue solution supply device, a dispensing device is arranged on the dispensing mechanism, the dispensing mechanism is further provided with an angle sensor, the machine body is provided with a controller, and the flip chip LED placing mechanism, the glue solution supply device and the dispensing mechanism are electrically connected with the controller. The problems that in the prior art, the dispensing efficiency is low, and dispensing is uneven are solved.

Description

technical field [0001] The invention relates to the field of dispensing technology, in particular to a general-purpose flip-chip LED dispensing machine and a dispensing method. Background technique [0002] The double dispensing head is used in conjunction with flip-chip LED chips. The flip-chip process has obvious advantages over the traditional "die bonding, wire bonding" process: 1. The production cycle is shortened; the traditional process is crystal bonding → sintering → wire bonding → mid-test → Packaging, the flip-chip process is die-bonding → reflow soldering → mid-test → packaging. The flip-chip process does not require a wire bonding process, and the production time is shortened by more than 60% compared with the traditional "die bonding, wire bonding" process. 2. The product quality is more stable; the flip-chip process does not have the disadvantages such as "glue, glue climbing, and wire rewinding" that are easy to occur in the traditional "die bonding, wire bon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10B05C1/02B05C13/02
CPCB05C1/02B05C11/101B05C13/02
Inventor 熊芳刘亮赵彦东肖章权
Owner JIANGXI LIANCHUANG NANFEN TECHNOLOGY CO LTD
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