Manufacturing method of coaxial adapter plate

A production method and coaxial transfer technology, applied in the manufacture of contact box/base, assembly/disassembly of contact, connection, etc., can solve the problems of soft tin package, easy to form pits, and increased resistance, and achieve The effect of accurate test results
CN113285330APending Publication Date: 2021-08-20QUANWISE MICROELECTRONICS (ZHUHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
QUANWISE MICROELECTRONICS (ZHUHAI) CO LTD
Publication Date
2021-08-20

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Abstract

The invention discloses a manufacturing method of a coaxial adapter plate. The manufacturing method comprises the following steps:manufacturing a plate: manufacturing a fixing plate made of a non-tin-sticking metal material according to a preset shape; punching: machining a a plurality of through holes in the surface of the fixing plate; and assembling: arranging a plurality of electric conductors in the through holes one by one, enabling one end of each electric conductor to be flush with one surface of the fixing plate, and connecting the other end of each electric conductor with a connecting part used for being connected with the PCB. According to the arrangement, the fixing plate is made of non-stick tin metal, and a tin material can be prevented from remaining on the fixing plate, so tin bags can be prevented from being formed, and the situation that resistance is increased after tin is oxidized is avoided; meanwhile, the through holes are formed in the fixing plate, one electric conductor is inserted into each through hole, and one end of each conductor is flush with one surface of the fixed plate, so that the surface of the fixed plate can be prevented from being uneven, the probe conductor can be in good contact with each conductor, and the test result is more accurate.
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Description

technical field

[0001] The invention relates to the technical field of electronic equipment, in particular to a method for manufacturing a coaxial adapter plate. Background technique

[0002] Chip testing is performed by conducting electrical signals to the PCB through probe conductors.

[0003] During the test, the original chip on the PCB needs to be removed, and there will be residual tin on the pad (PAD) on the PCB. The residual tin will be oxidized by the air, resulting in an increase in resistance. The tin package is soft and easy to form pits, making the probe conductors prone to poor contact. Contents of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a kind of manufacturing method of coaxial adapter plate, by adopting non-stick tin metal to make fixed plate, and make one end of the conductor in the fixed plate flush with the surface of the...

Claims

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