Method for processing TVS chip after blue film pasting

Abstract

The invention provides a method for processing a TVS chip after pasting a blue film, which comprises the following steps of: S1, preparing a wafer: taking the ground wafer for later use; S2, laser semi-cut-through: utilizing a laser cutting machine to perform semi-cut-through on the wafer along the scribing channel; S3, pasting a blue film: pasting the blue film on the uncut surface of the wafer; S4, preliminary baking: putting the wafer pasted with the blue film into a constant-temperature oven to be baked, and arranging upwards the surface, pasted with the blue film, of the wafer; S5, splitting: using a rolling rod to roll the wafer and splitting the wafer into core particles; S6, wafer expansion: placing the core particles with the blue film on a wafer expansion machine for wafer expansion; S7, stretching the blue film, wherein the core particles with the blue films are placed on a heating platform of a wafer expander, the surfaces, with the blue films, of the core particles face downwards, and the peripheries of the core particles are baked while being pulled; and S8, ending the operation. Through the eight processing steps which are arranged in sequence, the uniformity and the regularity of core particle arrangement can be improved, the situation of core particle scattering can be reduced, and then the post-processing packaging efficiency and the post-processing packaging quality can be improved.

Description

technical field [0001] The invention relates to the technical field of chip processing, in particular to a method for processing a TVS chip after pasting a blue film. Background technique [0002] At present, the common processing technology of the blue film chip is to paste the blue film on the GPP (GPP Chinese name: glass passivation) chip and use a blade to cut through it into a granular state, because the mechanical stress damage of the blade is relatively large, and the GPP chip is made of glass. The passivation layer has poor brittleness, and the crystal grains are susceptible to internal damage caused by stress. At the same time, the compactness between the crystal grains and the blue film leads to such damage not being detected in time, which eventually causes the terminal crystal grains to be damaged, resulting in product quality. decline. [0003] Existing publication number is the Chinese patent of CN111092045A, and it discloses a kind of novel GPP chip blue film...

AI Technical Summary

Problems solved by technology

[0004] The inventor believes that the chip blue film processing method in the prior art is easy to scatter before the blue film is pasted, the arrangement is irregular after the film is pasted, and there is no gap between the core particles And the corners of the core particles are easily damaged during the handling process, and there is room for improvement

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