A kind of indirect brazing method of aluminum nitride ceramic copper clad laminate

Abstract

The invention discloses an indirect brazing method for aluminum nitride ceramic copper-clad plates, belonging to the technical field of ceramic copper-clad plates. Preparation process: Mix Ag powder, Cu powder, copper-plated low-expansion ceramic powder and copper-plated graphene powder evenly to prepare composite solder, add organic binder to composite solder to prepare composite solder slurry; Active metal elements Ti, Zr, Hf or Cr are deposited on the surface of aluminum ceramics. After the composite solder is coated on the surface of the aluminum nitride ceramic substrate sputtered with active elements, an oxygen-free copper sheet is compounded on both sides, and the obtained assembly is dried and put into a vacuum furnace for brazing. The invention introduces the ceramic particles with low expansion coefficient into the brazing filler metal, so that the thermal expansion coefficient gradient of the joint is transitioned, thereby significantly reducing the residual stress level of the joint. The invention introduces the graphene with high thermal conductivity and high strength into the composite solder, which can not only increase the strength of the solder but also improve its thermal conductivity.

Description

A kind of indirect brazing method of aluminum nitride ceramic copper clad laminate technical field The present invention relates to ceramic copper clad laminate manufacturing technical field, be specifically related to a kind of indirect brazing of aluminum nitride ceramic copper clad laminate Welding method of manufacture. Background technique [0002] The ceramic copper clad laminate is composed of oxygen-free copper and a ceramic substrate, which takes into account the high conductivity and high conductivity of oxygen-free copper at the same time. Thermal properties and the high insulation and low expansion of ceramic materials are extremely important electronic packaging materials. Power locomotives, aerospace and other fields have broad application prospects. Aluminum nitride ceramics have high thermal conductivity and chemical stability Good and other outstanding advantages, it is a common material for manufacturing high thermal conductivity ceramic copper clad ...

AI Technical Summary

Problems solved by technology

[0004] However, due to aluminum nitride ceramics (4.7×10 -6 ℃ -1 ) and oxygen-free copper (18.6×10 -6 ℃ -1 ) There is a large difference in thermal expansion coefficient, and the connection area of ​​the ceramic copper clad laminate is relatively large (common product sizes are 4.5 inches, 6 inches, etc.), and the cold and heat cycle of the ceramic copper clad laminate during use will further lead to residual stress. accumulation

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