Semiconductor lamp with heat dissipation support

A technology of heat dissipation bracket and semiconductor, which is applied in semiconductor devices of light-emitting elements, lighting and heating equipment, cooling/heating devices of lighting devices, etc., which can solve the problems of affecting heat dissipation efficiency and poor circulation of hot air to the outside, so as to facilitate cooling Effect

Pending Publication Date: 2021-08-27
唐国远
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the semiconductor lamp with heat dissipation bracket is placed and used in a starch processing plant with low indoor temperature, due to the high temperature of the hot gas generated during the power-on and light-emitting operation of the semiconductor lamp, it will be discharged from the bracket, and the hot gas will meet in the air outlet of the bracket. Cold is easy to liquefy, which makes the starch powder in the external air combine with liquefied water stains, and powder agglomerates appear at the air flow port, resulting in poor circulation of hot air, which in turn affects heat dissipation efficiency

Method used

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  • Semiconductor lamp with heat dissipation support
  • Semiconductor lamp with heat dissipation support
  • Semiconductor lamp with heat dissipation support

Examples

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Embodiment 1

[0031] as attached figure 1 to attach Figure 7 Shown:

[0032] The invention provides a semiconductor lamp with a heat dissipation bracket, which is structured with a lamp board 1, a bearing board 2, a control source 3, and a circuit board 4, the lamp board 1 is located above the bearing board 2, and the circuit board 4 is installed on The top end of the carrier board 2 , the control source 3 is located beside the circuit board 4 .

[0033] The bearing plate 2 is provided with a bottom plate 21 and a bracket 22 , and the lower section of the bracket 22 passes through both sides of the bottom plate 21 and is movably matched.

[0034] Wherein, the bracket 22 is provided with a heat dissipation column 221, an adapter 222, a displacement block 223, and a lifting column 224. The adapter 222 and the heat dissipation column 221 are an integrated structure and are located at its top position. The displacement block 223 is movably connected. Cooperating with the upper end of the li...

Embodiment 2

[0041] as attached Figure 8 to attach Figure 9 Shown:

[0042] Wherein, the wiping ball a24 is provided with an outer ring w1, an expansion ring w2, an engaging block w3, a pressing ball w4, and a spring w5. The engaging block w3 is connected to the outer end of the expansion ring w2. The block w3 moves inside the outer ring w1, the engaging block w3 runs through the outer ring w1, the pressing ball w4 is located at the inner end of the expansion ring w2, and the two ends of the spring w5 are respectively connected to the expansion ring w2, the top The pressure ball w4 is connected and movably matched. The outer ring w1 is a rubber ring with a port and has a certain degree of flexibility. The expansion ring w2 has annular flexibility, and the pressure ball w4 has Predominantly, there are seven engaging blocks w3, which are uniformly arranged in a ring shape, and respectively correspond to the through-holes on the outer ring w1, and the pressing ball w4 acts on the expansio...

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PUM

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Abstract

The invention discloses a semiconductor lamp with a heat dissipation support. The semiconductor lamp is structurally provided with a lamp panel, a bearing plate, a control source and a circuit board. The lamp panel is located above the bearing plate, the circuit board is installed at the top surface end of the bearing plate, the control source is located on the side of the circuit board, a lifting column rotates and drives a displacement block to ascend and descend, and a movable body is driven by a centrifugal force to extend a rod frame, a wiping ball is driven to drive the swing block to swing and fold, a folding frame assists the swing block to change the folding direction, the swing block can swing and fold conveniently, airflow is driven in the change process, air is further activated, polymerized hot air can be quickly dispersed, and cooling of hot airflow is facilitated. Under the cooperation of the elastic limit of the elastic belt and the resilience force of the cushion block, a rolling ball rolls back and forth to generate an ejection force to the two ends of an elastic ejection body, the swinging and folding angle of the tough frame is increased in an auxiliary mode, under the through opening structure of the tough frame, the swinging and folding movement can branch air and facilitate a flowing force of outward diffusion of the air, and therefore hot airflow is enabled to be active due to a dispersing force.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting, and more specifically, relates to a semiconductor lamp with a cooling bracket. Background technique [0002] Semiconductor lamps are semiconductor energized luminous substances made of diodes, which improve lighting effects and provide light sources for people's lives and work. Semiconductor lamps with heat dissipation brackets can dissipate the heat generated in time during the energization and luminescence operation of semiconductor lamps. [0003] Based on the inventor's discovery above, the existing semiconductor lamps with heat dissipation brackets have the following deficiencies: [0004] When the semiconductor lamp with heat dissipation bracket is placed and used in a starch processing plant with low indoor temperature, due to the high temperature of the hot air generated during the power-on and light-emitting operation of the semiconductor lamp, it will be discharged outsid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21V29/70F21Y115/10
CPCF21V29/70F21K9/20F21Y2115/10
Inventor 唐国远
Owner 唐国远
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