Flatness detection method and device, leveling system and storage medium

Abstract

The embodiment of the invention provides a flatness detection method and device, a leveling system and a storage medium. The method comprises the following steps of determining a first exposure area in which the number of existing sampling points is smaller than a target number; determining a second exposure area from an adjacent exposure area of the first exposure area, wherein the sum of the number of sampling points of the first exposure area and the number of sampling points of the second exposure area is not smaller than the target number; determining supplementary sampling points for supplementing the first exposure area from the sampling points of the second exposure area, wherein the sum of the number of the supplementary sampling points and the number of the existing sampling points is equal to the target number; and detecting the flatness of the first exposure area according to the existing sampling points and the supplementary sampling points. According to the embodiment of the invention, the accuracy of the flatness detection result can be improved, and the exposure area capable of detecting the flatness is increased.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of exposure technology, and in particular to a flatness detection method, device, leveling system and storage medium. Background technique [0002] In the current chip manufacturing process, it is necessary to check the surface flatness of the workpiece carrying platform carrying the wafer before the wafer is exposed, so as to avoid problems such as exposure defocus after the wafer is exposed; the surface of the workpiece carrying platform can be divided into multiple There are three exposure areas used for exposure, and the surface flatness of the detection work platform can be realized by detecting the flatness of each exposure area. [0003] At present, the flatness of the exposure area is mainly detected based on the laser induction method. Specifically, multiple laser emitters are used to project laser light on the surface of the workpiece carrying platform, thereby forming mul...

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Problems solved by technology

[0003] At present, the flatness of the exposure area is mainly detected based on the laser induction method. Specifically, multiple laser emitters are used to project laser light on the surface of the workpiece carrying platform, thereby forming multiple sampling points on the surface of the workpiece carrying platform, and then by sensing the sampling in the exposure area. The reflected light beam of the point is used to detect the flatness of the exposure area; this method requires that the number of sampling points in the exposure area reaches the target number, so that the flatness of the exposure area can be detected more accurately, and the number of sampling points does not reach the target number In the exposed area, the flatness of the adjacent exposed area can only be used to replace the flatness of the exposed area, which leads to low accuracy of the flatness detection results

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