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A method of film thickness control

A technology of thickness control and adhesive film, which is applied in the direction of material gluing, device for coating liquid on the surface, connecting components, etc., can solve the problems such as the thickness control of the adhesive film and the uniformity of the adhesive film thickness can not be better guaranteed, to achieve Solve uneven bonding, improve production efficiency, and facilitate manufacturing

Active Publication Date: 2022-05-27
CENT SOUTH UNIV
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] The object of the present invention is to provide a kind of method of adhesive film thickness control, to solve the problem in the background technology that there is no better method for the control of adhesive film thickness of composite material overlapping at present in China. The problem that the uniformity cannot be better guaranteed

Method used

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  • A method of film thickness control
  • A method of film thickness control
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Experimental program
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Effect test

Embodiment 1

[0065] The thickness difference die plate used is 0.1mm higher than the lower connecting plate, and the upper connecting plate and the lower connecting plate are connected by the adhesive film by using the film thickness control device in the present invention, and the adhesive curing and forming are completed in the autoclave. , the actual film thickness is 108μm through measurement.

Embodiment 2

[0067] The thickness difference die plate used is 0.2mm higher than the lower connecting plate, and the upper connecting plate and the lower connecting plate are connected by the adhesive film by using the film thickness control device in the present invention, and the bonding and curing molding is completed in the autoclave. , the actual film thickness is 209μm through measurement.

Embodiment 3

[0069] The thickness difference die plate used is 0.5mm higher than the lower connecting plate, and the upper connecting plate and the lower connecting plate are connected by the adhesive film by using the film thickness control device in the present invention, and the bonding and curing molding is completed in the autoclave. , the actual film thickness is 522μm through measurement.

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Abstract

A method for controlling the thickness of an adhesive film, comprising using an adhesive film thickness control device, comprising the following steps: first selecting a suitable thickness difference die plate; on the surface of the film thickness control device and the connected upper connecting plate and lower connecting plate in order to lay polytetrafluoroethylene cloth, isolation film and air felt, wrap them as a whole and put them into a vacuum bag, and then together with Put the vacuum bag together into the autoclave, then complete the bonding and curing of the upper connecting plate and the lower connecting plate in the autoclave, and take out the glued parts to make the connection between the upper connecting plate and the lower connecting plate The thickness of the adhesive film is the target thickness of the adhesive film. The invention can better control the thickness of the glue film in the bonding process of the composite materials, thereby effectively controlling the bonding strength of the connecting joints of the composite materials, and effectively solving the problem of uneven bonding of the composite materials that is easy to occur in the bonding process of the composite materials. question.

Description

technical field [0001] The invention belongs to the technical field of composite material forming, and particularly relates to a method for controlling the thickness of an adhesive film. Background technique [0002] With the use of new materials such as aluminum alloys and composite materials, it is no longer suitable for material connection by welding. The existing composite material connection methods include mechanical connection, cemented connection and hybrid connection. Mechanical connections can cause stress concentration to a certain extent, so adhesive bonding is more widely used in the connection of composite materials than mechanical connections. As one of the main parameters of cemented connection, the thickness of the adhesive film directly affects the strength of the connection joint. In addition, studies have shown that the uniformity of the adhesive film thickness also affects the shear strength of the composite joint. In order to obtain the same strength o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C11/10B05D3/02F16B11/00
CPCB05C11/1005B05D3/0254F16B11/006
Inventor 湛利华刘聪彭益丰杨晓波肖瑜
Owner CENT SOUTH UNIV
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