Method for controlling thickness of adhesive film

Abstract

The invention provides a method for controlling the thickness of an adhesive film. The method comprises the step of using an adhesive film thickness control device and comprises the following steps that firstly, a proper thickness difference mold plate is selected; then, adhesive, an upper connecting plate and a lower connecting plate are arranged on the adhesive film thickness control device; and polytetrafluoroethylene cloth, an isolating film and breathable felt are sequentially laid on the surfaces of the adhesive film thickness control device and the connected upper connecting plate and lower connecting plate, the whole adhesive film thickness control device, the connected upper connecting plate and lower connecting plate are wrapped and then put into a vacuum bag, the adhesive film thickness control device, the connected upper connecting plate and lower connecting plate and the vacuum bag are put into an autoclave together, then, adhesive bonding curing forming of the upper connecting plate and the lower connecting plate is completed in the autoclave, and an adhesive bonding piece is taken out so that the thickness of the adhesive film used for connection between the upper connecting plate and the lower connecting plate can be the target thickness of the adhesive film. According to the method, the thickness of the adhesive film in the adhesive bonding process of a composite material can be well controlled, and therefore the adhesive bonding strength of a connecting joint of the composite material is effectively controlled, and the problem that adhesive bonding unevenness is prone to happening in the adhesive bonding connecting process of the composite material is effectively solved.

Description

technical field [0001] The invention belongs to the technical field of composite material forming, and in particular relates to a method for controlling the thickness of an adhesive film. Background technique [0002] With the use of new materials such as aluminum alloys and composite materials, material connection by welding is no longer applicable. The existing composite material connection methods include mechanical connection, cemented connection and hybrid connection. Mechanical connections will cause stress concentration to some extent, so adhesive bonding is more widely used in the connection of composite materials than mechanical connections. As one of the main parameters of the cemented connection, the thickness of the adhesive film directly affects the strength of the joint. In addition, studies have shown that the uniformity of the adhesive film thickness also has an impact on the shear strength of the composite joint. In order to obtain adhesive joints of equal ...

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a kind of method of adhesive film thickness control, to solve the problem in the background technology that there is no better method for the control of adhesive film thickness of composite material overlapping at present in China. The problem that the uniformity cannot be better guaranteed

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