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Thermal conductivity testing device for advanced inorganic non-metallic material

An inorganic non-metal, testing device technology, applied in the direction of material thermal conductivity, conveyor, transportation and packaging, etc., can solve the problems of affecting test accuracy, air heat dissipation, time-consuming and laborious, etc.

Inactive Publication Date: 2021-09-03
李永祥
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] After the production of advanced inorganic non-metallic materials, it is often necessary to test the thermal conductivity of advanced inorganic non-metallic materials. Now the thermal conductivity test device is prone to air heat dissipation during the test process. At this time, it is often necessary to embed the metal material in the In the test device, the test accuracy is increased, but in this process, it is often necessary to manually pull the placement frame, which is time-consuming and laborious, and now only the two sides of the material can be simply positioned, and the material is placed in the middle of the test frame when it is not easy , affecting the test accuracy

Method used

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  • Thermal conductivity testing device for advanced inorganic non-metallic material
  • Thermal conductivity testing device for advanced inorganic non-metallic material

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Embodiment Construction

[0031] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying Describes, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate in a specific orientation, and therefore should not be construed as limiting the invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.

[0032] In the description of the present invention, it should be noted that unless otherwi...

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PUM

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Abstract

The invention provides a thermal conductivity testing device for an advanced inorganic non-metallic material, which comprises supporting legs, a fixing frame, a testing frame, a control panel, a display screen and a folding and unfolding centering mechanism, the folding and unfolding centering mechanism is arranged at the upper end of the fixing frame, and a pushing mechanism drives a moving plate to move towards the upper end; the moving plate pushes the bearing rod and the bearing block to swing, the placing plate moves towards the front end of the testing frame, then the material is placed on the inner side of the placing plate and is centered and positioned through the four-corner positioning mechanism, then the pushing mechanism drives the moving plate to move towards the inner side of the testing frame, and then the testing frame tests the thermal conductivity of the material, and the advantage that the materials can be rapidly placed and centered and positioned is achieved.

Description

technical field [0001] The invention relates to the related field of processing of advanced inorganic non-metallic materials, in particular to a thermal conductivity testing device for advanced inorganic non-metallic materials. Background technique [0002] Inorganic non-metallic materials are materials composed of oxides, carbides, nitrides, halogen compounds, borides, silicates, aluminates, phosphates, borates and other substances of certain elements, among which advanced inorganic non-metallic materials Metal materials are widely used. [0003] After the production of advanced inorganic non-metallic materials, it is often necessary to test the thermal conductivity of advanced inorganic non-metallic materials. Now the thermal conductivity test device is prone to air heat dissipation during the test process. At this time, it is often necessary to embed the metal material in the In the test device, the test accuracy is increased, but in this process, it is often necessary t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/18B65G15/32
CPCG01N25/18B65G15/32
Inventor 李永祥
Owner 李永祥
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