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High temperature current sensor based on low temperature co-fired ceramic technology and its application and method

A technology of low-temperature co-fired ceramics and current sensors, which is applied in the direction of only measuring current, measuring current/voltage, and instruments, which can solve the problems of low measurement accuracy and achieve high connection reliability, low parasitic inductance, and small accuracy. Effect

Active Publication Date: 2022-05-17
NORTH CHINA ELECTRIC POWER UNIV (BAODING)
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing current measurement technology, the semiconductor current mirror and the printed circuit board (PCB) Rogowski coil have the problem of low measurement accuracy in high temperature environment

Method used

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  • High temperature current sensor based on low temperature co-fired ceramic technology and its application and method
  • High temperature current sensor based on low temperature co-fired ceramic technology and its application and method
  • High temperature current sensor based on low temperature co-fired ceramic technology and its application and method

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Embodiment Construction

[0044] The high-temperature current sensor based on low-temperature co-fired ceramic (LTCC) technology of the present invention can be manufactured by punching green ceramic strips, printing conduction strips, and laminating, and then embedding ferrite magnetic rings in it and sintering Handle implementation.

[0045] figure 1 The current measurement principle of the high-temperature current sensor based on the low-temperature co-fired ceramic (LTCC) technology proposed by the present invention—the schematic diagram of electromagnetic induction. The primary side current in the figure i 1 is the current to be measured, the secondary side induced current i 2 That is the output of the current sensor. R 2 is the equivalent resistance of the secondary side, L 1 with L 2 are the inductance of the primary side and the secondary side respectively, and M is the mutual inductance between the primary side and the secondary side. In the secondary circuit, by Kirchhoff's voltage...

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PUM

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Abstract

The high-temperature current sensor based on low-temperature co-fired ceramic technology is composed of a variety of low-temperature co-fired ceramic tape layers, and conductive tape is printed on the surface of the ceramic tape layer and stacked in a certain order; the low-temperature co-fired ceramic tape layer includes the top Cover, top power connection layer, top signal connection layer, ferrite bead wrap, ferrite bezel outer vertical connection layer, ferrite bezel, ferrite bezel center vertical connection layer, bottom signal connection layer, bottom signal collection layer, bottom substrate layer. The invention proposes a high-temperature current sensor based on low-temperature co-fired ceramic (LTCC) technology and ferrite magnetic ring coil method, which can realize the current measurement of the power module in a high-temperature environment, and has the advantages of accurate measurement, low cost, strong usability, and ease of use. Integration and easy promotion and many other advantages.

Description

technical field [0001] The invention relates to a high-temperature current sensor electronic device, in particular to a high-temperature current sensor based on low-temperature co-fired ceramic technology, and belongs to the field of electronic component design. Background technique [0002] With the development of industries such as electric vehicles, smart grids and aerospace, the application market of power electronic modules has become increasingly broad, and the good development prospects mean that higher requirements are put forward for the application performance of power modules. Because traditional power modules require complex heat dissipation control and cooling systems, the power density and overall efficiency are greatly reduced, and the system cost is significantly increased. Currently, power chips based on next-generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) are developing rapidly. The excellent performance advantage...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R19/00
CPCG01R19/0092Y02T10/40
Inventor 孙鹏张浩然彭娇阳赵志斌崔翔
Owner NORTH CHINA ELECTRIC POWER UNIV (BAODING)
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