An electroplating spray system
A technology of jet flow and electroplating tank, applied in electrolytic components, electrolytic process, printed circuit and other directions, can solve the problems of low electroplating TP value, poor electroplating solution exchange effect, poor hole filling performance, etc., and achieves high electroplating TP value, Good filling performance and good exchange effect
Active Publication Date: 2022-06-17
上海天承化学有限公司
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Problems solved by technology
[0004] Therefore, there is an urgent need for a new electroplating spray system to solve the problems of poor plating solution exchange effect, poor filling performance, and low electroplating TP value in the holes of IC substrates or similar substrates with high thickness to diameter ratio.
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[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0030] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must hav...
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Abstract
The invention relates to the technical field of integrated circuits and chip processing, and specifically discloses an electroplating jet flow system, which includes an electroplating tank, a cathode, two sets of anodes, two sets of combined nozzles and a fluid pump, wherein the cathode and the power supply The cathode is connected to the negative pole of the plate, and the cathode is electrically connected to the plated part. The two sets of anodes are respectively connected to the positive pole of the power supply and placed on both sides of the cathode. Two sets of combined nozzles are placed on both sides of the plated part. The jet flow direction is set facing the plate-plated parts. Each group of combined nozzles is provided with a water jet nozzle and a mixed-flow nozzle. The water-jet nozzle is set close to the plate-plated part, and the mixed-flow nozzle is set away from the plate-plated part. The electroplating jet flow system of the present invention, by adopting the combination of water jet nozzle and mixed flow nozzle, improves the problem of poor deep plating ability during electroplating through holes of plated parts with high thickness to diameter ratio, and improves the hole filling performance of electroplating. Effect.
Description
technical field [0001] The invention relates to the technical field of integrated circuits and chip processing, and in particular to an electroplating jet system. Background technique [0002] With the continuous development of chip technology, the size of the chip is getting smaller and smaller, and the number of pins is increasing, which makes the printed circuit board (PCB), traditional integrated circuit (IC carrier) or The wiring density of the board-like circuit layout increases, so there will be certain difficulties in electroplating, which can easily cause problems such as uneven color and lustre of the cathode board and poor deep plating ability (TP value). [0003] In order to improve the problem of low TP value of through-hole electroplating, the formula of electroplating solution or the structure of electroplating equipment are usually improved. In terms of equipment, it can be improved by adjusting the nozzle structure and flow rate of the electroplating device...
Claims
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IPC IPC(8): C25D17/00C25D7/00C25D5/08H05K3/42
CPCC25D17/00C25D7/00C25D5/08H05K3/424
Inventor 林章清王科章晓冬刘江波童茂军
Owner 上海天承化学有限公司