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Chip structure defect quality evaluation system and method

A technology for quality assessment and chip structure, applied in the field of chip manufacturing, which can solve problems such as low detection efficiency, poor detection accuracy, and inability to identify defect locations.

Active Publication Date: 2021-09-14
HUNAN INST OF METROLOGY & TEST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the common problems in the field such as low detection efficiency, poor detection accuracy, inability to identify defect positions, low degree of automation and relatively low detection speed, etc., the present invention is made

Method used

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  • Chip structure defect quality evaluation system and method
  • Chip structure defect quality evaluation system and method
  • Chip structure defect quality evaluation system and method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Embodiment one: combined with attached Figure 1-Figure 7 , provide a kind of quality evaluation system of chip structural defect, described evaluation system comprises detection device, positioning device, adjustment device, transportation device, processing device and processor, described detection device is configured to detect chip; Said positioning The device is configured to locate the detection position of the chip, and guide the detection device to detect the positioned position; the adjustment device is configured to adjust the position of the chip; the processing device is configured to Processing the data collected by the detection device; the processor is respectively connected to the detection device, the positioning device, the adjustment device, the transportation device and the processing device, and based on the processor Accurate and efficient detection or evaluation of the entire chip is realized under centralized control; the adjustment device is arr...

Embodiment 2

[0077] Embodiment 2: This embodiment should be understood as at least including all the features of any one of the foregoing embodiments, and further improved on the basis of it, according to Figure 1-Figure 7 In addition, the detection device is configured to determine the abnormal area on the chip; in addition, the detection device also cooperates with the monitoring mechanism during the detection process, so that the abnormal area on the chip The location can be accurately located or determined;

[0078]The detection optical element is configured to detect the edge of the abnormal area, and calculate the abnormal area, and at the same time, establish an abnormal area model based on the data collected by the detection optical element, there are:

[0079] (4)

[0080] Among them, S edge (i) is the area of ​​abnormal area; is an abnormal position coordinate function; it can be obtained according to the actual detection of the identification mechanism or the detection o...

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Abstract

The invention provides a chip structure defect quality evaluation system and method, the evaluation system comprises a detection device, a positioning device, an adjusting device, a transportation device, a processing device and a processor, the detection device is configured to detect a chip; the positioning device is configured to position the detection position of the chip and guide the detection device to detect the positioned position; the adjusting device is configured to adjust the position of the chip; and the processing device is configured to process the data acquired by the detection device. According to the invention, an identification device is adopted to detect the defect spot on the chip through the expected movement path, and the associated position can be detected based on the position; and the moving speed of the detection device is controlled or adjusted, so that the abnormal position of the detection device in the detection process can be accurately detected.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a system and method for evaluating the quality of chip structural defects. Background technique [0002] At present, many production lines still use traditional manual visual inspection. After defects are found, unqualified products are manually removed. Due to the large production volume of chips, operators work on continuous production lines, and long-term use of eyes causes visual fatigue. Subject to human subjective interference. [0003] For example, the prior art of CN101576508B discloses an automatic detection device and detection method for chip appearance defects. The standard formed by human vision is a non-quantitative and non-constant scale, which causes fluctuations in quality standards and directly leads to unstable product quality control. ;The judgment speed of the human eye is not as fast as the computer's image processing speed, which makes the detec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/66G01N21/88
CPCH01L21/67288H01L22/12H01L22/20G01N21/88
Inventor 向德朱宪宇王晋威李庆先刘良江刘青王思思彭巨陈岳飞
Owner HUNAN INST OF METROLOGY & TEST