A heat dissipation plate and processing method of a bsg motor inverter
A BSG motor, heat sink technology, applied in electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., can solve problems such as poor glue filling process effect, improve weldability and overall corrosion resistance , to meet the cooling requirements, the effect of high consistency
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Embodiment 1
[0039] The present embodiment is that the capacitor module positioning boss 3 height is 3.4mm, which not only ensures the filling effect, but also does not affect the thickness of the heat sink body and even the space utilization of the inverter. The capacitor module positioning boss 3 is provided with a avoidance gap 31 for better and capacitor module configuration. The capacitor module positioning boss 3 is provided with an internal threaded hole 33 on the upper end face, for and the capacitor module is paired with a fixed. The welding area of the power module 131 is 0.4mm flatness to achieve better welding effect.
[0040] Processing method: The present embodiment is divided into two components of the heat dissipation plate body and the cover plate 13 during processing, the cover plate 13 adopts the stamping process, and the heat sink plate body adopts die casting process. Die casting heat sink body at the same time die casting spoiler parts 121.spoiler parts 121 is a cylindric...
Embodiment 2
[0042] The present embodiment is that the capacitor module positioning the height of the boss 3 is 5mm, which not only ensures the filling effect, but also does not affect the thickness of the heat sink body and even the space utilization rate of the inverter. The U-shaped runner 12 is provided with a spoiler member 121, the spoiler member 121 by soldering fixed to the bottom of the U-shaped runner groove 12 can enhance the cooling medium fluid disturbance effect, enhance the heat dissipation effect, to ensure the normal operation of the power module, the spoiler member 121 is a plate-like bulge, the spoiler member 121 is arranged in accordance with the U-shaped runner groove 12 direction; the capacitor module positioning boss 3 upper end face is provided with a capacitor module positioning column 32, the capacitor module positioning column 32 upper end face is provided with an internal threaded hole 33, It is easy to adapt and fix different types of capacitor modules. The power m...
Embodiment 3
[0045] The present embodiment is that the capacitor module positioning the height of the boss 3 is 3.7mm, which not only ensures the filling effect, but also does not affect the thickness of the heat sink body and even the space utilization rate of the inverter. The assembly surface 2 is provided with a PCB mounting limit wall 22 along the end contour closed loop, which can effectively realize the installation positioning of the PCB module and facilitate the filling protection of the PCB module. The surface plating treatment is nickel plating treatment to improve the weldability of the heat sink plate body and the power module and the overall corrosion resistance of the heat sink plate body. The welding area of the power module 131 is 0.25mm to achieve better welding effect.
[0046] Processing method: The difference between the present embodiment and the above embodiment is that the stamping is made into a corrugated heat dissipation rib, the corrugated heat dissipation rib weldi...
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