7results about How to "Avoid glue leakage" patented technology

The present application relates to fuse assembly technical field, disclose a kind of assembly device for fuse copper cap, including inclined bracket body, and overturning baffle rotating in inclined bracket body end, a plurality of to be assembled fuse body are arranged on inclined bracket body, U-shaped frame is installed on inclined bracket body, and two opposite clamping components of opposite movement are provided on U-shaped frame, and opposite clamping component clamps the both ends of fuse body.The present application uses opposite clamping component to carry out synchronous clamping and positioning to both ends of fuse body, ensure that fuse body is always in central symmetric position;Through friction rubber wheel drive fuse body rotation at uniform speed, in combination with adjustable flow glue dispensing chamber, it can form uniform, controllable glue layer on the end surface of fuse body, avoid uneven glue amount or glue leakage problem, to improve the adhesion strength and assembly consistency of copper cap and fuse body.

The application relates to the technical field of injection molding machines, in particular to an electric shooting structure of an injection molding machine, which comprises an injection molding machine, one side of the injection molding machine comprises a mold, the mold is provided with a sprue, the other side of the injection molding machine comprises a shooting base, a feeding hopper, a cylindrical barrel and a plasticizing servo motor, the output end of the plasticizing servo motor is connected with a screw rod in the barrel, a processing structure is installed at the front end of the barrel, the processing structure is linked with a mechanical counting structure, through the processing structure, the function that the nozzle rotates in one direction when the shooting base moves forward and the nozzle automatically stops rotating when the shooting base retreats is realized, an additional motor or electric control driving is not needed, and only the shooting moving force can make the nozzle continuously and uniformly rotate in the process of close pressing, local long-term pressure wear and indentation of a sealing surface are effectively avoided, glue leakage is prevented from the root, shear force generated by rotation can break the sticking points of the melt, the risk of mold sticking is reduced, cold material, carbon deposition and residual material around the nozzle end face and the sprue can be automatically scraped off, and the self-cleaning effect is realized.

The utility model discloses a kind of glue-filling type waterproof connectors, including shell and circuit board, the inside lower portion of shell is equipped with cushion block, the inside middle portion of shell is installed in circuit board, and the left and right sides of circuit board are equipped with connector on top, the inside thread of connector is connected with screw, and one end of connector is equipped with inner core, outer skin is installed in the periphery of inner core, and the periphery of outer skin is provided with sealing washer.This kind of glue-filling type waterproof connector, compared with existing waterproof connector, circuit board is clamped to cushion block, so that circuit board is suspended in the air inside shell, connector is fixedly connected on circuit board by screw, without welding inner core to circuit board, simplify installation operation, outer skin is pressed between sealing washer by fixing block, it is convenient to fix outer skin while preventing glue leakage when pouring glue, upper cover is buckled to shell by buckle, while embedding column is embedded in cushion block when pressing block is pressed on circuit board, the fixing effect of circuit board is better.

The utility model discloses a light-proof glue filling tool which comprises a fixed bottom plate, a first diaphragm tank and a second diaphragm tank which are used for containing two different glues are arranged on the fixed bottom plate, a first glue output port is formed in the outlet end of the first diaphragm tank, and a second glue output port is formed in the outlet end of the second diaphragm tank; at least one product base for placing a glue pouring product is further arranged on the fixed bottom plate, the glue pouring product is provided with two glue storage pipes which are arranged in parallel, movable glue plugs are arranged in the glue storage pipes, one end of each glue storage pipe is a glue inlet which can be communicated with a glue output port, and the other end of each glue storage pipe is a glue plug hole for the corresponding glue plug to enter and exit. The product base is further provided with a detection device used for detecting the glue injection amount in the glue storage pipe. The device has the beneficial effects that the extension length and the position of the rubber plug in a glue filling product are detected through the sensor, so that the uniformity of the glue filling amount in the product is ensured, and the consistency of the product is improved.

The utility model relates to injection mold technical field discloses a kind of multi-cavity injection mold for film plug, including main component, including heat flow plate and hot nozzle, the hot nozzle is set in heat flow plate one side;Mounting assembly is located hot nozzle side, including mounting block and sealing element, the heat flow plate is equipped with mounting groove, the mounting block is engaged with the mounting groove, the sealing element is located in mounting groove, including fixed sleeve, deformation block, moving block, lifting block, push block and arc plate.The utility model has the beneficial effect that: the hot nozzle and shunt are installed using the mode of clamping, and sealing assembly is provided, with the pressure increase of injection molding glue flow, the sealing element is triggered to make the sealing between hot nozzle and shunt stronger, to effectively prevent plastic melt from leaking from the connecting gap, avoid the occurrence of glue leakage phenomenon, ensure the smooth progress of injection molding production.

The invention relates to a glue pouring heat dissipation method of a PCBA circuit board, which is characterized in that heat-conducting glue is poured into a prefabricated mold, so that the PCBA circuit board is tightly wrapped by the heat-conducting glue, close contact heat conduction is carried out on components, meanwhile, structural gaps are fully filled, and a large amount of heat storage is realized. After the heat-conducting glue is shaped, the surface becomes a smooth and flat surface, and a graphene high-heat-conduction heat-dissipation film is attached and wrapped immediately, so that uniform-temperature cooling of the whole product is realized.