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Sealing frame for sealing liquid metal, application, integrated heat dissipation structure, and electronic element

An electronic component and liquid metal technology, applied in electrical components, electric solid devices, semiconductor devices, etc., can solve problems such as liquid metal leakage, achieve the effect of strengthening rigidity, simple three-layer structure, and avoiding glue leakage

Pending Publication Date: 2017-07-18
广东光钛领先新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned technical problems in the prior art, the purpose of the present invention is to provide a sealing frame for sealing liquid metal and its application in electronic equipment, an integrated heat dissipation structure for sealing liquid metal, and the integrated heat dissipation structure using the integrated heat dissipation The electronic components made of the structure not only have good sealing performance to solve the technical problem that the liquid metal is prone to leakage, but also can improve the processing accuracy, simplify the preparation steps, and realize mass production

Method used

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  • Sealing frame for sealing liquid metal, application, integrated heat dissipation structure, and electronic element
  • Sealing frame for sealing liquid metal, application, integrated heat dissipation structure, and electronic element
  • Sealing frame for sealing liquid metal, application, integrated heat dissipation structure, and electronic element

Examples

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Effect test

Embodiment 1

[0037] Integrated heat dissipation structure for sealing liquid metal, such as Figure 3 to Figure 5As shown, it includes a liquid metal 60 and a sealing frame 1 for sealing the liquid metal 60, wherein: the sealing frame 1 includes a frame body 11 that matches the shape of the heating element 20 and is provided on both surfaces of the frame body 11 with thermally conductive adhesive layers 12. The frame body is provided with a through hole 111. The liquid metal 60 is filled in the through hole 111 and formed integrally with the sealing frame 1 through a die-casting process. The liquid metal 60 is formed into a sheet-like liquid metal 60 through a die-casting process. The sheet-like liquid metal 60 The size of is consistent with the size of the through hole 111. When in use, one surface of the frame body 11 is bonded to the heating element 20 through the thermally conductive adhesive layer 12, and the other surface is bonded to the heat sink 30 through the thermally conductive...

Embodiment 2

[0057] An electronic component such as Image 6 As shown, it includes a substrate 10 , a heating element 20 disposed on the substrate 10 , and a heat sink 30 , and also includes an integrated heat dissipation structure for sealing the liquid metal 60 , which is exactly the same as that of Embodiment 1. Wherein, one surface of the sealing frame 1 is bonded to the heating element 20 through the thermally conductive adhesive layer 12 arranged on the surface, and the other surface of the sealing frame 1 is bonded to the heat sink 30 through the thermally conductive adhesive layer 12 arranged on the surface. , so that the liquid metal 60 is sealed in the accommodating space among the sealing frame 1 , the heating element 20 and the heat sink 30 . When in use, the two surfaces of the sealing frame 1 are directly bonded to the heating element 20 and the radiator respectively through the heat-conducting adhesive layer 12. When the electronic components work, the heating element 20 gen...

Embodiment 3

[0059] The main technical scheme of the present embodiment is the same as that of embodiment 2, the difference is:

[0060] An electronic component such as Figure 7 As shown, the heat dissipation device includes a shielding cover 40, one surface of the sealing frame 1 is bonded to the heating element 20 through the thermally conductive adhesive layer 12 arranged on the surface, and the other surface of the sealing frame 1 is bonded to the heating element 20 through the thermally conductive adhesive layer arranged on the surface. The layer 12 is bonded to the bottom wall of the U-shaped groove of the shielding case 40, so that the liquid metal 60 is sealed in the accommodation space between the sealing frame 1, the heating element 20 and the U-shaped groove. During use, first bond one surface of the sealing frame 1 to the surface of the heating element 20, then buckle the shielding cover 40 upside down on the surface of the heating element 20, so that the bottom wall of the U-...

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Abstract

The invention relates to the technical field of heat dissipation of electronic equipment, and specifically relates to a sealing frame for sealing liquid metal, an application, an integrated heat dissipation structure for sealing the liquid metal, and an electronic element. The integrated heat dissipation structure comprises a sealing frame and liquid metal disposed in a through hole of the sealing frame. The sealing frame comprises a frame body and thermal conduction glue layers disposed on two surfaces of the frame body. The liquid metal is integrated with the sealing frame through the die-casting technique, and is sheet-shaped liquid metal. Compared with the prior art, the structure can play a role in sealing, avoids the leakage of the liquid metal, can precisely control the size of the sealing frame and the size of the thermal conduction glue layers, improves the machining precision, greatly simplifies the preparation steps, and can achieve the batch production.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a sealing frame for sealing liquid metal and its application, an integrated heat dissipation structure for sealing liquid metal, and electronic components. Background technique [0002] With the advent of the intelligent era, electronic equipment such as communication equipment is increasingly moving towards miniaturization, thinner, and higher performance. Various electronic components (such as IGBT modules, CPUs, etc.) need to be configured in the limited space inside electronic equipment, and their integration and assembly density continue to increase. Due to the miniaturization and thinning of electronic equipment, it provides a powerful application At the same time, it also leads to a sharp increase in its power consumption and heat generation, which has a serious impact on the performance of electronic components. [0003] In the prior art,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/473
CPCH01L23/3675H01L23/3736H01L23/473
Inventor 童潇楚盛郑海鹏葛爱雄廖太明
Owner 广东光钛领先新材料有限公司
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