LED module COB packaging technology and structure

A technology of LED module and packaging process, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low degree of automation, difficult control of yield rate, cumbersome process, etc., and achieve the effect of improving production yield rate

Inactive Publication Date: 2014-07-23
SHENZHEN JINGTAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This packaging process is currently the most mainstream COB packaging method in the industry. The process is relatively cumbersome. The current degree of automation of the dam and sealing process is very low, and the investment in labor is relatively large, and the yield rate is difficult to control. Therefore, the manufacturing cost of COB is relatively high.

Method used

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  • LED module COB packaging technology and structure
  • LED module COB packaging technology and structure
  • LED module COB packaging technology and structure

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] Please refer to Figure 2-Figure 5 :

[0034] The embodiment of the present invention discloses a LED module COB packaging process, including steps:

[0035] S1. Carry out wire bonding on the substrate 11 provided with glue injection holes 12;

[0036] S2, fixing the base plate 11 on the injection bottom mold;

[0037] S3, injecting glue to the glue injection hole 12 through the precise glue injection needle 22;

[0038] S4. After the colloid is sol...

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Abstract

The invention discloses an LED module COB packaging technology which includes the steps: S1, conducting crystal fixing and line welding on a substrate with glue injection holes, S2, fixing the substrate to a glue injection bottom mold, S3, conducting glue injection on the glue injection holes through an accurate glue injection syringe needle, and S4 conducting mold disassembling and molding on the substrate after glue is solidified. By means of the LED module COB packaging technology, the links of dam surrounding and glue sealing of a traditional COB packaging technology are improved, the dam surrounding technology is omitted, molds are directly used for conducting glue injection molding, the efficiency of the glue sealing link is improved by three to five times relative to the efficiency in a traditional mode, and the production efficiency and the production yield are greatly improved compared with the traditional COB packaging technology. The invention further provides an LED module COB packaging structure manufactured with the technology.

Description

technical field [0001] The invention relates to the technical field of LED module packaging, and more specifically relates to a LED module COB packaging process and structure. Background technique [0002] The existing LED mainstream packages include SMD (Surface Mounted Devices) package mode and COB (Chip on Board package, Chip on Board) package mode. The SMD package has a large thermal resistance, poor heat dissipation, and glare problems. On the application side, the device needs to be attached to a fixed substrate, and it can only be used in the lighting field that does not require high product performance. Compared with SMD packaging, COB packaging has certain performance improvement and cost advantages, and the cost performance is more prominent. The concept of bracket is eliminated, there is no reflow soldering, no SMT process, and it also avoids the glare problem in the application. [0003] The current mainstream COB packaging process is as follows: First, use dam ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/48H01L33/52H01L2933/0033H01L2933/005
Inventor 龚文
Owner SHENZHEN JINGTAI
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