Automatic packaging equipment for diode production

Abstract

The invention belongs to the technical field of diodes, particularly relates to automatic packaging equipment for diode production. The automatic packaging equipment comprises a packaging base, wherein an accommodating groove is formed in the packaging base; rubber rings are movably connected to the positions, located on the two sides of the accommodating groove, in the packaging base; the side surfaces of the rubber rings are movably connected with elastic pushing rods; one side of each elastic pushing rod is movably connected with a push column; one side of each push column is movably connected with an L-shaped moving rod; one end of each L-shaped moving rod is fixedly connected with a ratchet column; the side surface of each ratchet column is engaged with a rotating gear; the surface ofeach rotating gear is rotationally connected with a rotating rod; one end of each rotating rod is movably connected with a pushing and pressing rod; one side of each pushing and pressing rod is fixedly connected with a U-shaped base; and a glut dispensing base is arranged on one side of each U-shaped base. When the automatic packaging equipment is used, impurities in the air can be prevented fromcorroding a chip circuit to cause reduction of electrical performance, and the service life of the diode is prolonged.

Description

technical field [0001] The invention belongs to the technical field of diodes, in particular to an automatic packaging device for diode production. Background technique [0002] Diode packaging refers to connecting the circuit pins on the silicon chip to the external joints with wires in order to connect with other devices. Electronically, it not only plays the role of installation, fixing, sealing, protecting the chip and enhancing the electrothermal performance. The chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. [0003] In the process of packaging the diode, it is often necessary to dispensing the chip. During the dispensing process, the dispensing of the chip may be uneven due to the uneven force of the glue head, and after the dispensing is completed, There may also be glue leakage from the dispensing head, which affects the packaging of the diode. At the same...

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Problems solved by technology

[0003] In the process of packaging the diode, it is often necessary to dispensing the chip. During the dispensing process, the dispensing of the chip may be uneven due to the uneven force of the glue head, and after the dispensing is completed, There may also be glue leakage from the dispensing head, which affects the packaging of the diode. At the same time, if there are air impurities on the surface of the diode, it will often corrode the chip circuit and cause electrical performance to decline. Therefore, in view of this, for the current Some structures and deficiencies are studied and improved, and an automatic packaging equipment for diode production is provided, in order to achieve more practical value.

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