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Panel type plastic packaging mold and packaging method thereof

A technology of plastic encapsulation molds and packaging methods, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of removal, expensive plastic encapsulation molds, affecting equipment utilization, etc., and achieve the effect of effective removal and improvement of quality and appearance

Pending Publication Date: 2021-09-17
郑州兴航科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Different products need to develop different plastic sealing molds, and the plastic sealing molds are expensive, which is not conducive to product development; at the same time, it takes a long time to replace the plastic sealing molds to package different products, which affects the utilization rate of equipment
(2) The use of multi-cavity injection molds for plastic packaging will result in flashes at the root of the external pins of each product after injection molding. Some product flashes cannot be effectively removed by electroplating. The existence of flashes will affect the quality of subsequent electroplating. quality and appearance

Method used

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  • Panel type plastic packaging mold and packaging method thereof
  • Panel type plastic packaging mold and packaging method thereof
  • Panel type plastic packaging mold and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] For LQFP32 (32 pins, L×W×H: 10×10×1.4mm 3 ), LQFP48 (48 pins, L*W*H: 7×7×1.4mm 3 ) two packaging forms, the specific implementation steps are as follows:

[0058] Step 1: For the two packaging forms, use their own dedicated lead frames to complete chip bonding and bonding;

[0059] Step 2: Since the thickness of the plastic package is the same, the same plastic package mold with a thickness of 1.4mm can be used for plastic sealing. Injection molding is performed on the LQFP32 lead frame first, and the LQFP32 lead frame is taken out from the plastic sealing mold;

[0060] Step 3: Carry out injection molding of the LQFP48 lead frame again, and take out the LQFP48 lead frame from the plastic sealing mold after the plastic sealing is completed;

[0061] Step 4: Baking and curing the plastic-encapsulated LQFP32 lead frame and LQFP48 lead frame;

[0062] Step 5: Place the LQFP32 lead frame under the laser head, and keep the chip plastic package 10×10mm 2 In the area, oth...

Embodiment 2

[0069] For a SOP20 (20 pins, length x width x height: 12.75 x 7.5 x 2.34mm 3 ), SOP28 (28 pins, L*W*H: 18×7.5×2.34mm 3 ) two packaging forms, the specific implementation steps are as follows:

[0070] Step 1: For the two packaging forms, use their own dedicated lead frames to complete chip bonding and bonding;

[0071] Step 2: Since the thickness of the plastic package is the same, the same plastic sealing mold with a thickness of 2.34mm can be used for plastic sealing. First carry out injection molding to the SOP20 lead frame, and take out the SOP20 lead frame from the plastic sealing mold;

[0072] Step 3: Perform injection molding of the SOP28 lead frame again, and take out the SOP28 lead frame from the plastic sealing mold after the plastic sealing is completed;

[0073] Step 4: Baking and curing the plastic-encapsulated SOP20 lead frame and SOP28 lead frame;

[0074] Step 5: Place the SOP20 lead frame under the laser head, keep the chip plastic package 12.75×7.5mm 2 ...

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Abstract

The invention discloses a panel type plastic package mold and a packaging method thereof. The panel type plastic package mold comprises an upper mold and a lower mold, the upper mold and the lower mold are mutually spliced to form the plastic package mold, the plastic package mold is internally provided with a plastic package mold cavity, the plastic package mold cavity is arranged at the connecting part of the upper mold and the lower mold, the plastic package mold is provided with an injection molding runner, the injection molding runner is communicated with the plastic package mold cavity; and the plastic package mold cavity is a panel type cavity and is used for placing the lead frame bonded with the chip. The method comprises the following steps: placing a lead frame provided with a bonded chip in the plastic package mold cavity of the plastic package mold; enabling an injection molding rod to inject the flowing plastic packaging material into the plastic packaging mold cavity; forming a panel plastic package body after injection molding and curing, opening a plastic package mold through a plastic package press, taking out the lead frame after injection molding and curing, placing the lead frame after injection molding by adopting the plastic package mold under a laser head, reserving a chip plastic package body area, and performing laser etching removal on a non-chip plastic package body area to finish packaging.

Description

technical field [0001] The invention belongs to the field of packaging and testing of semiconductor integrated circuits, in particular to a panel-type plastic sealing mold and a packaging method thereof. Background technique [0002] Lead frame packaging technology is the most basic and common packaging technology. It is widely used in the packaging of various consumer electronics and industrial electronics products. It has the advantages of high technology maturity, low cost, and strong compatibility. There are various lead frame packaging forms, mainly including TO, SOT, DIP, SOP, QFP, QFN, DFN and other series, and each series is divided into different pin positions and different sizes of packaging forms. For example, the SOP series can be divided into SOP8 ( 4.88×3.90×1.45mm 3 ), SOP14(8.66×3.90×1.45mm 3 ), SOP20(12.75×7.50×2.34mm 3 ), SOP28(18.00×7.50×2.34mm 3 ) and other package forms, each package form is unique in terms of pin position and size. At present, ther...

Claims

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Application Information

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IPC IPC(8): H01L21/56
CPCH01L21/565H01L21/56
Inventor 周少明李颖郭星
Owner 郑州兴航科技有限公司
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