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Soft magnetic ferrite material, inductor and manufacturing technology

A soft ferrite and manufacturing process technology, applied in the direction of inductor/transformer/magnet manufacturing, transformer/inductor coil/winding/connection, inorganic material magnetism, etc., can solve the problem of low Curie temperature and low inductor work. Stability and other issues, to achieve the effect of increasing Curie temperature, reducing performance defects, and excellent high temperature performance

Active Publication Date: 2009-04-15
SHENZHEN ZHENHUA FU ELECTRONICS
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Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a soft ferrite material, which aims to solve the problem that the curie temperature of the ferrite material of the inductor core in the prior art is not high, so that the molded inductor is not stable in high temperature environment The problem

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  • Soft magnetic ferrite material, inductor and manufacturing technology
  • Soft magnetic ferrite material, inductor and manufacturing technology
  • Soft magnetic ferrite material, inductor and manufacturing technology

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] In the technical field of soft ferrite materials, its main component is mainly Fe 2 o 3 , ZnO, NiO, CuO, MgO, etc., the selection principles are mainly based on the following requirements: (1) According to the customer's use requirements, the data of parameters such as magnetic permeability or impedance under specific measurement conditions are given for selection; ( 2) According to the customer's incoming sample, after measuring with the factory, determine the similar material grade. (3) Search and determine according to the material grades produced by the peers provided by the customer. ...

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Abstract

The invention provides a soft magnetic ferrite material, which comprises the following raw materials by weight portions: 55-70 percent of Fe2O3, 9.5-19.5 percent of ZnO, 15-30 percent of NiO, 5-10 percent of CuO, 0.2-0.5 percent of combustion improver and 0.3-0.6 percent of mineralizer. An inductor made by adopting the materials comprises a soft magnetic ferrite core, a coil coated on the core, a wire connected with the core and an epoxy resin layer coated on the external surfaces of the core and the coil; a buffer layer is further arranged on the adjoining surface of the external surface of the coil and the epoxy resin layer. The invention also provides a manufacture process for an inductor. The adoption of the inductor can improve the curie temperature of a core material and meet the requirement of ferrite magnetism materials needed by a high-performance mould pressing inductor. The working temperature of the molded inductor can increase from present -40-105 DEG C to -55-125 DEG C and the environment classification can reach 2B.

Description

technical field [0001] The invention relates to the field of soft ferrite materials, in particular to a nickel-zinc soft ferrite material used for manufacturing inductor cores, an inductor made of the material and a manufacturing process for the inductor. Background technique [0002] Soft ferrite material is one of the most widely used magnetic materials in the electronics industry. With the development of information industry, digital technology and optical fiber communication technology, the application field of soft ferrite has been continuously expanding, and it has been used in various fields of the national economy. be widely used. Inductor is the most widely used device in communication equipment and other radio devices. It not only requires high quality factor and stability, but also requires small size. Electronic complete machines require the development of ultra-miniaturization, miniaturization, lightweight, and standardization of various devices. LGA and LGB t...

Claims

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Application Information

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IPC IPC(8): H01F1/36H01F27/30H01F41/02B22F3/00
Inventor 丁晓鸿付贤民王胜刚滕林樊应县肖倩黄寒寒王上衡王裕凡
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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