LED circuit board with high heat dissipation performance and preparation method thereof
A technology for LED circuit boards and circuit boards, which is applied in the directions of printed circuits, circuit thermal devices, and printed circuit components connected with non-printed electrical components, can solve unfavorable use, poor heat dissipation effect of circuit boards, and affect product use. life and other issues, to achieve the effect of extending the service life, improving the heat dissipation effect, and improving the heat dissipation effect.
Active Publication Date: 2021-09-21
广东合通建业科技股份有限公司
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Problems solved by technology
[0003] The LED circuit board is to weld the LED lamp on the circuit board. When the LED lamp is working, it will generate a lot of heat, but most of the existing circuit boards have poor heat dissipation effect, which will affect the service life of the product and is not conducive to use.
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[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The specific embodiments described here are only used to explain the present invention, not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0038] The present invention provides such Figure 1-4 The shown LED circuit board with high heat dissipation performance includes a circuit board body 1, the circuit board body 1 is set as an aluminum circuit board body, the surface of the circuit board body 1 is fixedly welded with LED lamp beads 2, and the top center of the circuit boa...
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The invention discloses an LED circuit board with high heat dissipation performance, which comprises a circuit board main body, wherein the circuit board main body is an aluminum circuit board main body, LED lamp beads are fixedly welded on the surface of the circuit board main body, a weight reduction opening is formed in the center of the top part of the circuit board main body, the weight reduction opening is of a parallelogram structure, heat dissipation holes are formed in one side of the top part of the circuit board body, the heat dissipation holes are formed in the two sides of the weight reduction opening, a heat dissipation fan is fixedly installed on one side of the top part of the circuit board body, the heat dissipation fan is arranged at the edge position of the circuit board body, and heat dissipation fins are installed on the side, opposite to the heat dissipation fan, of the top part of the circuit board body. The structure of a traditional LED circuit board is changed, the heat dissipation fins and the heat dissipation fan are used in cooperation to conduct heat dissipation on the circuit board, heat dissipation is further conducted on the circuit board through a water cooling mechanism, and therefore the heat dissipation effect of the circuit board is improved, and the service life of a product is prolonged.
Description
technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to an LED circuit board with high heat dissipation performance and a preparation method thereof. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum circuit board body, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board , Ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. [0003] The LED circuit board is to weld the LED lamp on the circuit board. When the LED lamp is working, it will generate a lot of heat. However, most of the existing circuit boards have poor heat dissipa...
Claims
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IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0201H05K1/18
Inventor 陈子安李鸿光罗明辉刘序平
Owner 广东合通建业科技股份有限公司