Main board of router and router

A technology for routers and mainboards, which is applied in the fields of modification through conduction and heat transfer, cooling/ventilation/heating transformation, electrical components, etc. It can solve the problems of high cost, reduce thermal impact, prevent heat source baking, and reduce design costs.

Pending Publication Date: 2021-09-24
SHENZHEN GONGJIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a motherboard of a router, which aims to solve the problem of high cost in the traditional FLASH chip cooling method

Method used

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  • Main board of router and router
  • Main board of router and router
  • Main board of router and router

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Experimental program
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Embodiment Construction

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0028] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0029] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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PUM

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Abstract

The invention provides a main board of a router and the router. The main board of the router comprises a FLASH chip main circuit and a multi-layer PCB for bearing the main circuit and the FLASH chip, the main circuit and the FLASH chip are oppositely arranged on the PCB at a preset interval, baking of a heat source is prevented, meanwhile, the FLASH chip and the main circuit are arranged on different arrangement areas respectively, The FLASH chip and the GND network are isolated through the first isolation groove, heat transfer of the GND network is reduced, heat influence of a heat source on the FLASH chip is reduced and the temperature of the FLASH chip is reduced by arranging the isolation groove and keeping away from the heat source, meanwhile, a cooling fin does not need to be arranged or a vehicle-level material does not need to be changed, and the design cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of routers, and in particular relates to a router main board and a router. Background technique [0002] For router products with small size and high power consumption, it is easy to cause the temperature of the device to exceed the device specification during the thermal test, and the test fails. [0003] Among them, the flash chip is a material that is more likely to fail the thermal test. First, the commonly used flash thermal parameters are low, and the surface temperature is generally less than 90°C; Baked by heat. [0004] According to the current design method, if you want to solve the thermal problem, you must either add a heat sink to the Flash, or use automotive-grade Flash materials. [0005] However, adding heat sinks will increase the material cost and production cost, and there is also the problem of high cost if the car-grade material is used instead. Contents of the invention [0006] Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04Q1/02H05K7/20
CPCH04Q1/035H05K7/20509
Inventor 陈广达刘尚民陈晓山
Owner SHENZHEN GONGJIN ELECTRONICS CO LTD
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